Advanced Packaging Bond Debond Engineer - Sr. Staff

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 120,000 - 180,000; Full time

Job summary

SkyWater Technology, Inc. in Florida is seeking an experienced Bonding and Debonding Development Engineer to lead and improve bonding/debonding process flows for client packages, including Si interposer, FanOut, and hybrid bonding methods.

You will work with cross-functional teams to deliver high-yield, qualifiable products and develop robust recipes and test methods. You will also create training and technical papers, utilize metrology to diagnose defects, and drive process integration across

Qualifications

• 7+ years of Process Development & Integration in Advanced Packaging fab environments.
• Experience with FanOut wafer level assembly, Quantum, Si Interposer, and Hybrid Bonding.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.

Responsibilities

• Lead bonding/debonding process flows and develop qualifiable final products for foundry clients.
• Identify gaps in process flows and drive rapid prototyping with external partners.
• Create training documents and write technical papers to disseminate state-of-the-art technologies.
• Use metrology to characterize processes, identify root causes, and document results.
• Monitor SPC charts and drive improvements with cross-functional teams.
• Collaborate with integration and process engineers to optimize tool and process interplay.

Skills

Process development

Integration engineering

Advanced packaging

DOE / SPC / Six Sigma

Project management

Problem solving

Cross-functional collaboration

Education

BS Engineering

MS/PhD preferred

Tools

Process tools knowledge

Job description

Position Summary:

We are looking for a hardworking, and passionate experienced Bonding and Debonding Development Engineer for our Florida Advanced Packaging site. In this role, you will be responsible to lead, develop and improve the overall bonding and debonding process flows to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Areas of Accountability:

Transfer a client’s package requests into a bond/debond process flow that may utilize Si interposer, FanOut, superconducting materials and hybrid bonding manufacturing processes. The bonding may be permanent (e.g. fusion, hybrid) or temporary utilizing thermal, laser or chemical release technologies. Identify areas that require development and lead the module team to deliver on schedule and with high yield a qualifiable final product. Highlight any potential gaps in a process flows and build external partnerships to enable fast turn prototyping. When required, lead task forces to identify root causes, correct and maintain product deliverables.

• Support integration engineers to enable new process needs for each project.
• Create training documents & write technical papers to teach state-of-the-art technologies within SkyWater and external.
• Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding that comprehend upstream and downstream product requirements and process flows.
• Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices
• Integrate TSV first and / or TSV last process flows to enable Foundry client packages.
• Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
• Utilize data analysis software to drive data driven decisions
• Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
• Incorporate, monitor and improve electrical test parametrics to deliver an electrically good final package.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:

Education: BS Engineering, MS/PhD preferred

Experience and Skills:

• 7+ years of Process Development & Integration Engineer in Advanced Packaging Fab environment of 10K and 1K clean rooms related to FanOut wafer level assembly, Quantum, Si Interposer and Hybrid Bonding.
• Advanced Packaging Fab processing tools knowledge/experience
• MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship Required

: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

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