Lead Principal Engineer, Die-to-Wafer Hybrid Bonding

Intel Corporation; Hillsboro (OR); On-site; USD 211,000 - 298,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon seeks a Principal Engineer to define and scale next‑generation die-to-wafer hybrid bonding technologies for advanced packaging. You will drive technology roadmaps, mentor staff, and partner with equipment vendors to deliver robust, manufacturable solutions across TD and HVM environments.

You will contribute to process development, yield improvement, and reliability enhancements while aligning technical strategies with corporate goals and cost efficiency.

Qualifications

• Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
• Experience in hybrid bonding equipment development, process development, yield improvement, and reliability enhancement.
• FOK platform or equipment development and scaling to high-volume manufacturing (HVM).

Responsibilities

• Define and drive the hybrid bonding technology roadmap, including pitch scaling and yield targets.
• Lead module-level process development for die-to-wafer hybrid bonding.
• Drive first-of-a-kind equipment and platform development from concept to production.
• Address bonding challenges such as voids, adhesion failures, alignment, and contamination control.
• Collaborate with vendors and manufacturing teams to scale solutions to HVM.
• Mentor and develop technical leaders, ensuring capability growth across the team.

Skills

Hybrid bonding

Wafer bonding

Process development

Packaging integration

Education

Bachelor's degree + 15+ years experience

Master's degree + 10+ years experience

PhD + 8+ years experience

Job description

Intel Corporation in Hillsboro, Oregon seeks a Principal Engineer to define and scale next‑generation die-to-wafer hybrid bonding technologies for advanced packaging. You will drive technology roadmaps, mentor staff, and partner with equipment vendors to deliver robust, manufacturable solutions across TD and HVM environments.

You will contribute to process development, yield improvement, and reliability enhancements while aligning technical strategies with corporate goals and cost efficiency.