Hybrid Bonding Module Engineer — Die-to-Wafer

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 147,000 - 203,000; Full time

Benefits offered by this job

Comprehensive benefits package

Job summary

Applied Materials, Inc. in Santa Clara, CA, seeks a Die-to-Wafer Hybrid Bonding Module Engineer to scale next-generation hybrid bonding for advanced packaging, memory, chiplets, and AI accelerators.

You will lead process module development across die prep, surface activation, die placement, bonding, post-bond characterization, yield improvement, and manufacturing scale-up, collaborating with equipment teams, materials scientists, device architects, and customers.

Qualifications

• Advanced packaging and hybrid bonding knowledge required.
• Experience applying DOE and statistical methods to improve yield.
• Strong collaboration across equipment, process, and design teams.

Responsibilities

• Develop and optimize die-to-wafer hybrid bonding processes.
• Establish process windows for activation, placement, and bonding.
• Support integration into memory, chiplet, and interposer platforms.
• Lead yield improvement, defect analysis, and DOE studies.
• Drive reliability and characterize post-bond performance.

Skills

Hybrid bonding

Wafer bonding

Cu-Cu interconnect

Chiplet integration

HBM development

Process development

DOE analysis

Statistical process control

Education

M.S./Ph.D. in Materials Science, EE, ME, Chemical Eng., Physics

Tools

JMP

Minitab

Job description

Applied Materials, Inc. in Santa Clara, CA, seeks a Die-to-Wafer Hybrid Bonding Module Engineer to scale next-generation hybrid bonding for advanced packaging, memory, chiplets, and AI accelerators.

You will lead process module development across die prep, surface activation, die placement, bonding, post-bond characterization, yield improvement, and manufacturing scale-up, collaborating with equipment teams, materials scientists, device architects, and customers.