Lead Telecommunications Designer — Hybrid

Jacobs; Lawrence (KS); Hybrid; USD 81,000 - 140,000; Full time

Benefits offered by this job

Medical, Dental, Vision

401(k) plan

Stock purchase plan

PPTO

Holidays

Caregiver leave

Job summary

Jacobs is seeking a Sr. Telecommunications Designer to lead telecom design for complex facilities, including semiconductor manufacturing projects. You will oversee 3D BIM delivery, construct specifications, and coordinate with architects and engineers to meet client needs while applying NEC and TIA standards in a hybrid U.S.

role. You will collaborate with a global team to deliver OSP to backbone systems, rack layouts, and room designs using Revit MEP, Navisworks, and Bluebeam, while guiding

Qualifications

• Two-year technical degree or four-year non-technical degree.
• 5+ years of relevant experience in telecommunications design and construction industry.
• Knowledge & application of telecommunications industry standards (TIA).
• Knowledge of BICSI design practices.
• Knowledge of NFPA 70 NEC and electrical design requirements.
• Experience leading a telecommunications design team.
• Experience editing design and construction specifications.
• Experience with start-up and commissioning of telecommunications systems.
• Experience estimating and scheduling design efforts for large multi-building projects.

Responsibilities

• Lead portions of very large telecom projects as scope owner.
• Interface with client counterparts to meet their needs.
• Create fully coordinated 3D BIM models across disciplines using Revit MEP and Navisworks.
• Develop outside plant to backbone distribution layouts and room plans.
• Ensure designs comply with NEC, TIA, and Jacobs specifications.

Skills

Telecommunications design

Navisworks

Bluebeam

Leadership

Project coordination

Electrical design

Revit

Education

Two-year technical degree

Bachelor’s degree

Professional Engineer (PE) license

Tools

Navisworks

Revit

Bluebeam

Job description

Jacobs is seeking a Sr. Telecommunications Designer to lead telecom design for complex facilities, including semiconductor manufacturing projects. You will oversee 3D BIM delivery, construct specifications, and coordinate with architects and engineers to meet client needs while applying NEC and TIA standards in a hybrid U.S.

role. You will collaborate with a global team to deliver OSP to backbone systems, rack layouts, and room designs using Revit MEP, Navisworks, and Bluebeam, while guiding