Senior Telecom Design Lead for Semiconductor Facilities

Jacobs; Henderson (NV); Hybrid; USD 81,000 - 140,000; Full time

Job summary

Jacobs seeks a Sr. Telecommunications Designer to lead design, modeling and documentation for telecom on advanced facilities, including semiconductor manufacturing.

This hybrid, U.S.-based role works with architects and engineers to deliver fully coordinated 3D BIM designs using Revit MEP and Navisworks, from Outside Plant to backbone distribution. You will guide portions of large projects, interface with client counterparts, and apply NEC, TIA and BICSI standards while mentoring staff.

Qualifications

• Two-year technical degree or four-year non-technical degree.
• At least 5 years of telecom design and construction experience.
• Knowledge of TIA standards and BICSI design practices.
• Knowledge of NFPA 70 (NEC) and electrical design requirements.
• Experience leading a telecom design team.
• Experience editing design and construction specifications.
• Experience with start-up and commissioning of telecom systems.
• Experience estimating and scheduling design efforts for large multi-building projects.
• Strong structured cabling design background.
• Proficiency with Bluebeam and Navisworks.

Skills

Strong communication skills

Navisworks

Bluebeam

Revit

DAS systems knowledge

OSP design

Education

Two-year technical degree

Four-year non-technical degree

Bachelor’s degree

Tools

Navisworks

Bluebeam

Job description

Jacobs seeks a Sr. Telecommunications Designer to lead design, modeling and documentation for telecom on advanced facilities, including semiconductor manufacturing.

This hybrid, U.S.-based role works with architects and engineers to deliver fully coordinated 3D BIM designs using Revit MEP and Navisworks, from Outside Plant to backbone distribution. You will guide portions of large projects, interface with client counterparts, and apply NEC, TIA and BICSI standards while mentoring staff.