Lead SoC Package Substrate Engineer – Global Travel

Apple Inc.; San Francisco (CA); On-site; USD 129,300 - 225,300; Full time

Benefits offered by this job

Stock programs

Education reimbursement

Health and dental coverage

Job summary

Apple Inc. in San Francisco Bay Area is seeking a lead for substrate technology development within the packaging team.

The role focuses on owning package substrate technology development, from concept to HVM, and driving architecture optimization across cross-functional groups to achieve best performance and reliability. Lead efforts include collaboration with foundries and OSAT, 5% international travel, and defining roadmaps for future substrate solutions.

Qualifications

• Bachelor's degree in a relevant field required.
• MS or PhD with 3+ years of relevant industry experience preferred.
• In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.

Responsibilities

• Develop substrate technologies from concept to HVM for Apple packaging roadmap.
• Define and optimize new package substrate architectures based on performance, risk, cost, and availability.
• Troubleshoot technical issues during the full product development cycle.

Skills

Substrate technology

Project management

Technical leadership

Education

Bachelor's degree

MS or PhD

Tools

Cadence Allegro

Job description

Apple Inc. in San Francisco Bay Area is seeking a lead for substrate technology development within the packaging team.

The role focuses on owning package substrate technology development, from concept to HVM, and driving architecture optimization across cross-functional groups to achieve best performance and reliability. Lead efforts include collaboration with foundries and OSAT, 5% international travel, and defining roadmaps for future substrate solutions.