Packaging Substrate Engineer

Apple Inc.

San Francisco (CA)

On-site

USD 129,300 - 225,300

Full time

14 days+

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Benefits offered by this job

Stock programs
Education reimbursement
Health and dental coverage

Job summary

Apple Inc. in San Francisco Bay Area is seeking a lead for substrate technology development within the packaging team.

The role focuses on owning package substrate technology development, from concept to HVM, and driving architecture optimization across cross-functional groups to achieve best performance and reliability. Lead efforts include collaboration with foundries and OSAT, 5% international travel, and defining roadmaps for future substrate solutions.

Qualifications

  • Bachelor's degree in a relevant field required.
  • MS or PhD with 3+ years of relevant industry experience preferred.
  • In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.

Responsibilities

  • Develop substrate technologies from concept to HVM for Apple packaging roadmap.
  • Define and optimize new package substrate architectures based on performance, risk, cost, and availability.
  • Troubleshoot technical issues during the full product development cycle.

Skills

Substrate technology
Project management
Technical leadership

Education

Bachelor's degree
MS or PhD

Tools

Cadence Allegro

Job description

San Francisco Bay Area, California, United States Hardware

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.

Description

Lead SoC package substrate technology development, pathfinding, and roadmap definition. Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions. 5% International travel

Responsibilities
  • Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
  • Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.
  • Problem solving of technical issues during the full product development cycle.
Minimum Qualifications
  • Minimum requirement of a bachelors degree
Preferred Qualifications
  • MS and or Ph.D. and 3+ years of relevant industry experience.
  • In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
  • Hands‑on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
  • Familiarity with package assembly and integration process preferred.
  • Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
  • Exceptional technology development & project management skills.

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $129,300 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.

Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

Learn about accessibility in Apple’s workplace.

Learn about reasonable accommodations for job applicants.

Apple accepts applications to this posting on an ongoing basis.

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