Senior Thin-Film Process Engineer (CVD/ALD/PVD) - Hybrid

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 255,000; Full time

Benefits offered by this job

Hybrid work model

Stock bonuses

Health benefits

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a Senior Engineer to drive thin film deposition process innovation for HVM. You will lead development, optimization, and manufacturability across CVD/ALD/PVD, ensuring seamless transitions from development to high-volume production for Intel 18A, 3, 12nm and beyond.

The role demands expertise in process development, technical leadership, and collaboration with Technology Development, Manufacturing, and supplier teams to meet aggressive node targets.

Qualifications

• Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field.
• 5+ years semiconductor industry experience with strong focus on thin film deposition processes -OR- PhD and 3+ years of Industry experience
• Proven experience in process development, technical leadership, and manufacturing engineering
• Experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization
• Comprehensive fab startup experience across manufacturing, quality, RandD, and supply chain functions
• Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems

Responsibilities

• Process Innovation & Excellence Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules
• Drive defectivity reduction and uniformity improvements through systematic process enhancement
• Lead technical problem resolution and deliver solutions that meet aggressive technology node targets
• Optimize equipment performance working with internal teams and key suppliers
• Strategic Technical Leadership Align technical vision with customer requirements and business objectives
• Synthesize complex technical data to formulate and execute strategic responses
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines
• Deliver rapid execution of innovative solutions to meet challenging development timelines
• Cross-Functional Partnership Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups
• Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers
• Present technical findings effectively to diverse audiences from engineering teams to executive leadership
• Foster in-person collaboration to accelerate decision-making and problem resolution
• Industry Leadership Stay current with semiconductor industry trends and emerging process technologies
• Drive strategic initiatives that position Intel at the forefront of manufacturing innovation
• Contribute to technology roadmaps through hands-on technical expertise and market insight

Skills

Technical leadership

Cross-functional collaboration

Analytical skills

Communication skills

Problem solving

Education

Master's degree in STEM field

PhD (preferred)

Tools

AMAT

LAM

ASM

TEL

Job description

Intel Corporation in Hillsboro, Oregon, seeks a Senior Engineer to drive thin film deposition process innovation for HVM. You will lead development, optimization, and manufacturability across CVD/ALD/PVD, ensuring seamless transitions from development to high-volume production for Intel 18A, 3, 12nm and beyond.

The role demands expertise in process development, technical leadership, and collaboration with Technology Development, Manufacturing, and supplier teams to meet aggressive node targets.