Director, Package Design Engineering

Renesas Electronics Corp.; Arizona; On-site; USD 180,000 - 240,000; Full time

Job summary

Renesas Electronics Corp. is seeking a senior Package Technology Development leader to drive R&D and NPI for AI/Datacenter infrastructure power packaging.

You will manage OSAT/CM collaborations, define roadmaps, and optimize processes to meet stringent product qualifications. The role requires 15 to 20 years in package development with emphasis on power SiP/module and wafer-level/flip-chip packaging, plus strong analytical and presentation skills.

Qualifications

• Doctorate/Masters/Bachelors in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Lead package technology development and NPI, R&D, and global OSAT management.
• Develop and qualify power SiP/module packaging and interconnect methods.
• Collaborate with OSAT/CM and Product teams to optimize processes and ensure quality.
• Establish production controls and ramp-up monitoring.

Skills

Power SiP packaging

Wafer-level packaging

Flip-chip interconnects

OSAT/CM coordination

DOE process optimization

Education

PhD/MS/BS in Physics/Engineering

15–20 years package development

Tools

Statistical Analysis (SPC)

DOE software/tools

Job description

Responsibilities:

• Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs.
• Focus on design and development of package and interconnect methods for Renesas's AI/Datacenter Infrastructure Power packaging needs especially Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FET packages. Scope also involves WBG (Ie. SiC & GaN) development along with DBC, AMB substrates and advanced interconnect technologies. Knowledge of wafer level, flip-chip, multi-chip module and power devices will be a plus.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitors to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
• Establish & maintain package design rules.

• Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.