Lead Power Electronics Packaging for SiC/GaN Devices

Heisler Semiconductor LLC; Maryland; Vor Ort; USD 120.000 - 160.000; Vollzeit

Zusammenfassung

Heisler Semiconductor LLC in Halethorpe, MD is seeking a power electronics packaging engineer to lead high-voltage packaging for SiC and GaN devices. You will design packages, run simulations, and work closely with our founder and process team from RFQ through build and test.

Requires MS/PhD in EE or BS with industry power packaging experience, hands-on design and test expertise, and proficiency with thermal or EM tools. Some travel to partner labs is expected.

Qualifikationen

• MS/PhD in Electrical Engineering or BS with industry experience in power packaging.
• Hands-on design and build of power modules or packages.
• Experience with thermal or electromagnetic simulation and lab testing of power devices.

Aufgaben

• Design packages and modules for SiC and GaN power devices: substrates, die attach, interconnect, insulation and terminations.
• Run thermal, electrical and insulation analysis and design for low inductance and margin.
• Design test fixtures and perform electrical characterization: static, double-pulse and high-voltage testing.
• Review RFQs for technical feasibility and help scope quotes.
• Write technical sections for research proposals and funded programs.
• Collaborate with assembly and process engineers to turn designs into builds.

Kenntnisse

Power electronics

Design and build power modules

Thermal simulation

Electrical testing

Ausbildung

MS or PhD in Electrical Engineering

BS with equivalent industry experience

Tools

ANSYS

COMSOL

Q3D

Jobbeschreibung

Heisler Semiconductor LLC in Halethorpe, MD is seeking a power electronics packaging engineer to lead high-voltage packaging for SiC and GaN devices. You will design packages, run simulations, and work closely with our founder and process team from RFQ through build and test.

Requires MS/PhD in EE or BS with industry power packaging experience, hands-on design and test expertise, and proficiency with thermal or EM tools. Some travel to partner labs is expected.