Power Electronics Design Engineer

Heisler Semiconductor LLC; Maryland; On-site; USD 120,000 - 160,000; Full time

Job summary

Heisler Semiconductor LLC in Halethorpe, MD is seeking a power electronics packaging engineer to lead high-voltage packaging for SiC and GaN devices. You will design packages, run simulations, and work closely with our founder and process team from RFQ through build and test.

Requires MS/PhD in EE or BS with industry power packaging experience, hands-on design and test expertise, and proficiency with thermal or EM tools. Some travel to partner labs is expected.

Qualifications

• MS/PhD in Electrical Engineering or BS with industry experience in power packaging.
• Hands-on design and build of power modules or packages.
• Experience with thermal or electromagnetic simulation and lab testing of power devices.

Responsibilities

• Design packages and modules for SiC and GaN power devices: substrates, die attach, interconnect, insulation and terminations.
• Run thermal, electrical and insulation analysis and design for low inductance and margin.
• Design test fixtures and perform electrical characterization: static, double-pulse and high-voltage testing.
• Review RFQs for technical feasibility and help scope quotes.
• Write technical sections for research proposals and funded programs.
• Collaborate with assembly and process engineers to turn designs into builds.

Skills

Power electronics

Design and build power modules

Thermal simulation

Electrical testing

Education

MS or PhD in Electrical Engineering

BS with equivalent industry experience

Tools

ANSYS

COMSOL

Q3D

Job description

Heisler Semiconductor designs and builds advanced semiconductor packages and test hardware for companies and research groups developing RF, mmWave, power, MEMS and sensor devices. We take work from design through assembly and characterization. Power packaging is one of our fastest-growing lines, and we're building the team to meet it.

Location: Halethorpe, MD (bwtech@UMBC) or York, PA · Full-time · On-site, with regular travel to partner research labs

The role

You'll lead the power side of our design work: packaging high-voltage wide-bandgap devices so they survive the voltage, heat and switching speed they were built for. You'll work directly with the founder and our process team, from a customer's first RFQ through design, build and test.

What you'll do

• Design packages and modules for SiC and GaN power devices: substrates, die attach, interconnect, insulation and terminations.
• Run thermal, electrical and insulation analysis (FEA, parasitic extraction) and design for low inductance and partial-discharge margin.
• Design test fixtures and run electrical characterization: static, double-pulse and high-voltage testing.
• Review incoming RFQs for technical feasibility and help scope quotes.
• Write technical sections for research proposals and funded programs.
• Work alongside our assembly and process engineers to turn designs into builds that yield.

What you need

• MS or PhD in Electrical Engineering, or BS with equivalent industry experience, focused on power electronics or power packaging.
• Hands-on design and build of power modules or packages.
• Experience with thermal or electromagnetic simulation (ANSYS, COMSOL, Q3D or similar).
• Experience testing power devices in the lab.
• Clear technical writing, and comfort working directly with customers.

Nice to have

• Medium- or high-voltage (≥3.3 kV) packaging and insulation design.
• Sintered silver, AMB/DBC substrates, or encapsulation process experience.
• Proposal writing for federal research programs.
• Cleanroom or microelectronics assembly exposure.

This role involves export-controlled work and is open to U.S. persons only: U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C. 1324b. Heisler Semiconductor does not sponsor employment visas for this role. Status is verified at hire.

Heisler Semiconductor is an equal opportunity employer.