Staff Engineer, Packaging Mechanical Simulation

Samsung Semiconductor

San Jose (CA)

On-site

USD 163,000 - 253,000

Full time

14 days+

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Benefits offered by this job

Paid time off 4+ weeks
Holidays & sick leave
Fertility/adoption stipend
Medical/Dental/Vision/401k package
Onsite café & gym

Job summary

Samsung Semiconductor in San Jose is hiring a Packaging Engineer, Mechanical Simulation to lead the development and design evaluation of next-generation semiconductor packages and memory devices through advanced mechanical modeling.

You will collaborate with cross-functional, multicultural teams to drive innovative packaging solutions, automate simulation workflows, and bridge numerical predictions with experimental validation. Location is daily onsite at our San Jose HQ.

Qualifications

  • PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a closely related discipline.
  • 3-5+ years of hands-on modeling and simulation experience in the high-tech or semiconductor industry.
  • Proven expertise with leading simulation tools such as ANSYS, Abaqus, HyperMesh and their associated pre-/post-processing software.
  • Extensive experience in static and dynamic simulations, covering linear and nonlinear analyses that involve geometric and material non‑
  • In-depth understanding of advanced semiconductor packaging, interconnect structures, and reliability-modeling techniques.
  • Strong technical-writing skills, capable of producing clear, comprehensive documentation and communicating complex concepts to both technical and non‑technical audiences.
  • You’re inclusive, adapting your style to the situation and diverse global norms of our people.
  • An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
  • You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
  • Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Responsibilities

  • Perform advanced numerical modeling and simulation to evaluate and improve the performance and reliability of cutting‑edge semiconductor packages and memory devices.
  • Provide mechanical design support throughout package‑and system‑development stages—from concept and detailed modeling to qualification and reliability testing.
  • Apply hands‑on expertise in mechanical and thermal modeling of micro‑electronic components, including interconnects, solder joints, BGAs, and advanced‑packaging architectures.
  • Develop and maintain scripts for process automation (Python, MATLAB, or ANSYS APDL) to streamline pre‑processing, simulation, and post‑processing workflows for parametric and sensitivity studies.
  • Leverage a solid understanding of semiconductor manufacturing, advanced‑packaging technologies, material properties, and associated design and reliability constraints.
  • Design, execute, and interpret validation experiments that correlate and calibrate simulation models with empirical data.
  • Contribute effectively both independently and as a member of cross‑functional, cross‑cultural, and globally distributed teams.

Skills

Modeling & simulation
Python/MATLAB scripting
Technical writing
Cross-functional teaming

Education

PhD in Mechanical Engineering or related

Tools

ANSYS
Abaqus
HyperMesh

Job description

Please Note

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period.

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period.

Advancing the World’s Technology Together

Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future.

We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.

Samsung Semiconductor is hiring for a Packaging Engineer, Mechanical Simulation role to lead the development and design evaluation of next‑generation semiconductor packages and memory devices through advanced mechanical modeling. You will collaborate with cross‑functional, multicultural teams to drive innovative packaging solutions, automate simulation workflows, and bridge the gap between numerical predictions and experimental validation.

Location: Daily onsite presence in San Jose HQ location in alignment with our Flexible Work policy with an average of 10% travel per month.

Job ID: 42974

What You’ll Do
  • Perform advanced numerical modeling and simulation to evaluate and improve the performance and reliability of cutting‑edge semiconductor packages and memory devices.
  • Provide mechanical design support throughout package‑and system‑development stages—from concept and detailed modeling to qualification and reliability testing.
  • Apply hands‑on expertise in mechanical and thermal modeling of micro‑electronic components, including interconnects, solder joints, BGAs, and advanced‑packaging architectures.
  • Develop and maintain scripts for process automation (Python, MATLAB, or ANSYS APDL) to streamline pre‑processing, simulation, and post‑processing workflows for parametric and sensitivity studies.
  • Leverage a solid understanding of semiconductor manufacturing, advanced‑packaging technologies, material properties, and associated design and reliability constraints.
  • Design, execute, and interpret validation experiments that correlate and calibrate simulation models with empirical data.
  • Contribute effectively both independently and as a member of cross‑functional, cross‑cultural, and globally distributed teams.
What You Bring
  • PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a closely related discipline.
  • 3-5+years of hands‑on modeling and simulation experience in the high‑tech or semiconductor industry.
  • Proven expertise with leading simulation tools such as ANSYS, Abaqus, HyperMesh, and their associated pre‑/post‑processing software.
  • Extensive experience in static and dynamic simulations, covering linear and nonlinear analyses that involve geometric and material non‑
  • In‑depth understanding of advanced semiconductor packaging, interconnect structures, and reliability‑modeling techniques.
  • Strong technical‑writing skills, capable of producing clear, comprehensive documentation and communicating complex concepts to both technical and non‑technical audiences.
  • You’re inclusive, adapting your style to the situation and diverse global norms of our people.
  • An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
  • You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
  • Innovative and creative, you proactively explore new ideas and adapt quickly to change.
What We Offer

The pay range below is for all roles at this level across all US locations and functions. Pay within this range varies by work location and may also depend on job‑related knowledge, skills, and experience. We also offer incentive opportunities that reward employees based on individual and company performance.

This is in addition to our diverse package of benefits centered around the wellbeing of our employees and their loved ones. In addition to the usual Medical/Dental/Vision/401k, our inclusive rewards plan empowers our people to care for their whole selves. An investment in your future is an investment in ours.

  • Give Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.
  • Enjoy Time Away You’ll start with 4+ weeks of paid time off a year, plus holidays and sick leave, to rest and recharge.
  • Care for Family Whatever family means to you, we want to support you along the way—including a stipend for fertility care or adoption, medical travel support, and virtual vet care for your fur babies.
  • Prioritize Emotional Wellness With on‑demand apps and free confidential therapy sessions, you’ll have support no matter where you are.
  • Stay Fit Eating well and being active are important parts of a healthy life. Our onsite Café and gym, plus virtual classes, make it easier.
  • Embrace Flexibility Benefits are best when you have the space to use them. That’s why we facilitate a flexible environment so you can find the right balance for you.

Base Pay Range

$163,000-$253,000 USD

Equal Opportunity Employment Policy

Samsung Semiconductor takes pride in being an equal opportunity workplace dedicated to fostering an environment where all individuals feel valued and empowered to excel, regardless of race, religion, color, age, disability, sex, gender identity, sexual orientation, ancestry, genetic information, marital status, national origin, political affiliation, or veteran status.

When selecting team members, we prioritize talent and qualities such as humility, kindness, and dedication. We extend comprehensive accommodations throughout our recruiting processes for candidates with disabilities, long‑term conditions, neurodivergent individuals, or those requiring pregnancy‑related support. All candidates scheduled for an interview will receive guidance on requesting accommodations.

Our Commitment to Innovation and Fairness

At Samsung Semiconductor, we use Artificial Intelligence (AI) tools in the recruitment process to enhance efficiency. However, AI is used as a support tool, not a final decision‑maker. All hiring decisions are made by our human recruiting team and hiring managers to ensure every candidate is evaluated fairly and holistically.

Recruiting Agency Policy

We do not accept unsolicited resumes. Only authorized recruitment agencies that have a current and valid agreement with Samsung Semiconductor, Inc. are permitted to submit resumes for any job openings.

Applicant AI Use Policy

At Samsung Semiconductor, we support innovation and technology. However, to ensure a fair and authentic assessment, we ask that candidates rely on their own knowledge and skills throughout the process. AI tools may be used for basic preparation, grammar, and research, but should not be used to generate or assist with submitted content or live interview responses. If we determine that AI is being used outside these guidelines, we reserve the right to pause or end the interview, and your candidacy may be disqualified.

Trade Secret Notice

By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

Applicant Privacy Policy

https://semiconductor.samsung.com/about-us/careers/us/privacy/

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