Staff Packaging Mechanical Simulation Engineer

PVH (Tommy Hilfiger/Calvin Klein); San Jose (CA); On-site; USD 125,000 - 180,000; Full time

Benefits offered by this job

PTO 4+ weeks

Fertility/adoption stipend

Medical/Dental/Vision/401k

Job summary

Samsung Semiconductor seeks a Packaging Engineer, Mechanical Simulation in San Jose to lead modeling and evaluation of next‑gen packages. You'll collaborate with cross‑functional teams, automate workflows, and connect numerical predictions with experiments.

PhD in a related field and 3–5+ years in high‑tech packaging simulations are required, with strong skills in ANSYS/Abaqus/HyperMesh and scripting for automation.

Qualifications

• PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field.
• 3–5+ years of hands-on modeling and simulation in high-tech or semiconductor industries.
• Experience with ANSYS, Abaqus, HyperMesh and related pre/post-processing tools.
• Strong understanding of static and dynamic simulations and nonlinear analyses.
• Excellent technical writing and ability to communicate complex concepts clearly.

Responsibilities

• Perform advanced numerical modeling to evaluate semiconductor packages and memory devices.
• Provide mechanical design support from concept through qualification and testing.
• Model mechanical and thermal behavior of micro-electronic components and interconnects.
• Develop scripts (Python, MATLAB, or APDL) to automate simulations and studies.
• Collaborate with cross-functional teams and communicate results clearly.

Skills

Python scripting

Numerical modeling

Mechanical simulation

Cross-functional teamwork

Documentation writing

Education

PhD in Mechanical Engineering

Tools

ANSYS

Abaqus

HyperMesh

Job description

Samsung Semiconductor seeks a Packaging Engineer, Mechanical Simulation in San Jose to lead modeling and evaluation of next‑gen packages. You'll collaborate with cross‑functional teams, automate workflows, and connect numerical predictions with experiments.

PhD in a related field and 3–5+ years in high‑tech packaging simulations are required, with strong skills in ANSYS/Abaqus/HyperMesh and scripting for automation.