Staff Engineer, Packaging Simulation – Hybrid Modeling Lead

Segment (Twilio)

San Jose (CA)

On-site

USD 163,000 - 253,000

Full time

14 days+

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Job summary

Samsung Semiconductor in San Jose is seeking a Staff Engineer, Packaging Mechanical Simulation to lead development and evaluation of next‑generation semiconductor packages through advanced mechanical modeling. You will collaborate with cross‑functional teams to drive innovative packaging solutions, automate simulation workflows, and validate models with experiments.

Ideal candidates have a PhD and 3–5+ years in high‑tech packaging with experience in ANSYS, Abaqus, and HyperMesh, plus strong

Qualifications

PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or closely related discipline.
3–5+ years hands-on modeling and simulation in high-tech or semiconductor industry.
Experience with leading simulation tools (ANSYS, Abaqus, HyperMesh) and pre-/post-processing software.

Responsibilities

Perform advanced numerical modeling and simulation to evaluate and improve semiconductor package and memory device performance and reliability.
Provide mechanical design support through concept to qualification and reliability testing.
Apply mechanical and thermal modeling of micro-electronic components (interconnects, solder joints, BGAs, advanced-packaging architectures).
Develop and maintain scripts for automation (Python, MATLAB, ANSYS APDL) to streamline workflows for parametric studies.
Correlate simulation models with empirical data through validation experiments.
Collaborate effectively within cross-functional, cross-cultural, globally distributed teams.