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CspeedIO, Inc. in Palo Alto, CA, seeks a seasoned packaging engineer to drive 2.5D/3D high‑speed interposer packaging from concept to production. You will coordinate photonic and electronic co‑design, and establish design rules with OSATs and foundries.
Collaborating with silicon photonics, IC design, layout, test and reliability teams, you will ensure manufacturability and reliability of the package while managing schedules and external partners.
CspeedIO, Inc. in Palo Alto, CA, seeks a seasoned packaging engineer to drive 2.5D/3D high‑speed interposer packaging from concept to production. You will coordinate photonic and electronic co‑design, and establish design rules with OSATs and foundries.
Collaborating with silicon photonics, IC design, layout, test and reliability teams, you will ensure manufacturability and reliability of the package while managing schedules and external partners.