Packaging Integration Engineer

CspeedIO, Inc.; Palo Alto (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

CspeedIO, Inc. in Palo Alto, CA, seeks a seasoned packaging engineer to drive 2.5D/3D high‑speed interposer packaging from concept to production. You will coordinate photonic and electronic co‑design, and establish design rules with OSATs and foundries.

Collaborating with silicon photonics, IC design, layout, test and reliability teams, you will ensure manufacturability and reliability of the package while managing schedules and external partners.

Qualifications

• Understanding of 2.5D and 3D packaging technologies including interposers and high-density interconnects.
• Strong program/project management skills with ability to schedule and track parts and milestones.
• Clear communication across design, SI/PI, testing, vendors, OSATs, and cross-functional teams.

Responsibilities

• Drive Cspeed's packaging from initial concept to production.
• Establish photonic and electronic co-design process flow.
• Work with OSATs to define packaging rules, process flow, and materials.
• Lead optical package development to establish manufacturability and reliability.
• Collaborate with cross-functional teams including silicon photonics, IC design, layout, test and reliability to drive the package/integration forward.
• Work with external foundries and OSATs on process integration and packaging for interposer.

Skills

2.5D/3D packaging

Program management

Cross-functional communication

Reliability and testing

Mechanical/thermal analysis

Education

B.S. in EE/Materials/Optics

Job description

CspeedIO is a stealth startup backed by Sutter Hill Ventures and Atreides Capital - headquartered in Palo Alto, CA. Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware.
CspeedIO is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true "scale-up" architectures. Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures.

Duties, Deliverables, And Responsibilities

• Drive Cspeed's package from initial concept to production
• Help establish photonic and electronic co-design process flow
• Work with OSATs to define integration packaging design rules, process flow, and materials
• Lead optical package development to establish package manufacturability and reliability
• Collaborate with cross-functional teams including silicon photonics, IC design, layout, test and reliability to drive the package/integration forward
• Work with external foundries and OSATs on process integration and packaging for interposer

Expertise, Knowledge, And Skills

• Understanding of 2.5D and 3D packaging technologies, i.e. interposers, heterogeneous integration, high-density interconnects
• Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging)
• Must have strong program/project management skills (i.e. set schedule, maintain it, ensure parts arrive on time in the right place, etc.)
• Clear communication, ability to work cross-functionally and interface with design, SI/PI, testing, vendors, OSATs, etc
• Bonus: Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis

Experience, Background, And Accomplishments

• Driven multiple 2.5D/3D high-speed packages end to end, working with all roles on the packaging team (design, layout, SI/PI, test and reliability, etc.)
• Experience driving packages with unconventional needs / uncommon processes
• Experience working with large, established OSATs and foundries on custom processes and flows
• B.Sc.+ in EE or Materials or Optics