Lead High-Speed IC Package Design Engineer

Turkish Aerospace Industries, Inc.; United States; On-site; USD 120,000 - 180,000; Full time

Job summary

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to lead the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

The role involves end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, working closely with silicon, PCB, and system teams.

Qualifications

• Senior-level engineer with ownership of complex IC package designs.
• Strong background in high-speed packaging and signal integrity.

Responsibilities

• Lead design, simulation, and validation of high-speed IC packages.
• Collaborate with silicon, PCB, and system teams; develop reusable libraries.

Job description

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to lead the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

The role involves end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, working closely with silicon, PCB, and system teams.