Senior Mechanical-Photonic Packaging Engineer

NOKIA; New York (NY); On-site; USD 120,000 - 150,000; Full time

Job summary

Nokia's Advanced Packaging R&D team seeks a mechanical engineer to drive the development of high‑performance electro‑optic modules and to integrate Silicon Photonics transceivers from concept to new product introduction.

You will design, simulate, and validate packaging architectures, coordinate with vendors, and ensure manufacturability and cost targets are met in a high‑volume setting.

Qualifications

• 5–8 years of extended experience in high‑volume packaging of 2.5/3D packages.
• Expertise in next generation advanced photonics packaging technologies.
• Experience with package and process design/development from design to production.
• Expertise in material properties and yield/failure mode analysis.
• Experience with fabrication, inspection, and assembly documentation.

Responsibilities

• Lead Package Design and Architecture with cross‑functional teams to meet requirements.
• Apply Design for Manufacturing principles with production volume focus.
• Drive technology development for next generation product design.
• Perform FEA structural analysis (linear, nonlinear, dynamic) using software.
• Perform thermal and thermo‑mechanical simulations.
• Maintain mechanical drawings and BOM for new products.
• Plan prototype assembly builds for early design validation.
• Drive package debug during product validation and qualification.
• Survey new materials and vendors for Advanced Packaging.
• Develop semiconductor and optical packaging processes in‑house or with contract manufacturers.

Skills

3D CAD design

GD&T proficiency

Thermal/thermo‑mechanical simulations

FEM/FEA analysis

Cross‑functional collaboration

Education

Advanced Degree in Mechanical Engineering or similar field

Tools

SolidWorks

ANSYS

Job description

Nokia's Advanced Packaging R&D team seeks a mechanical engineer to drive the development of high‑performance electro‑optic modules and to integrate Silicon Photonics transceivers from concept to new product introduction.

You will design, simulate, and validate packaging architectures, coordinate with vendors, and ensure manufacturability and cost targets are met in a high‑volume setting.