High-Speed Package Design Engineer

Turkish Aerospace Industries, Inc.; United States; On-site; USD 120,000 - 180,000; Full time

Job summary

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to lead the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

The role involves end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, working closely with silicon, PCB, and system teams.

Qualifications

• Senior-level engineer with ownership of complex IC package designs.
• Strong background in high-speed packaging and signal integrity.

Responsibilities

• Lead design, simulation, and validation of high-speed IC packages.
• Collaborate with silicon, PCB, and system teams; develop reusable libraries.

Job description

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadershipisthe primary emphasis of this role.

This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.