Lead Silicon Photonics Packaging Engineer

NOKIA; Sunnyvale (CA); On-site; USD 100,000 - 130,000; Full time

Job summary

NOKIA is seeking a Packaging Development Engineer in Sunnyvale, California, to lead the design of next-generation packaging solutions for optical technologies. In this role, you will innovate and collaborate with cross-functional teams on key processes like flip chip and reflow.

Your expertise in high-speed electronics packaging and problem-solving will drive the development to ensure seamless mass production of advanced optical packages. If you have strong communication skills and a passion for technology, we encourage you to apply!

Qualifications

• 5-8 years of experience in high-speed electronics and Silicon Photonics package design.
• Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering.
• Solid interpersonal and communication skills.

Responsibilities

• Lead next generation Silicon Photonics package design.
• Own all the development of advanced packaging activities and designs.
• Optimize the assembly of electrical and optical engines.

Skills

High-speed electronics packaging design

Silicon Photonics package design

Problem-solving skills

Interpersonal skills

Communication skills

Tools

SEM/XSEM

Confocal microscopy

Acoustic imaging

Job description

NOKIA is seeking a Packaging Development Engineer in Sunnyvale, California, to lead the design of next-generation packaging solutions for optical technologies. In this role, you will innovate and collaborate with cross-functional teams on key processes like flip chip and reflow.

Your expertise in high-speed electronics packaging and problem-solving will drive the development to ensure seamless mass production of advanced optical packages. If you have strong communication skills and a passion for technology, we encourage you to apply!