Senior High-Speed IC Package Design Architect

NOKIA; New Providence (NJ); On-site; USD 100,000 - 130,000; Full time

Job summary

NOKIA is seeking a High-Speed Package Design Engineer based in New Providence, New Jersey. This role involves leading the design, simulation, and validation of advanced IC packages for RF and mixed-signal systems. Candidates should hold an MS or PhD in Electrical Engineering and have over 5 years of relevant experience.

The successful candidate will work on design methodologies, team integration, and contribute to technology files and verification flows. Strong skills in electromagnetics and signal integrity are essential.

Qualifications

• 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications.
• Strong fundamentals in electromagnetics, signal integrity, and power integrity.
• Ability to work independently and collaboratively in a cross-functional, research-driven environment.

Responsibilities

• Lead the design and development of high-speed IC packages.
• Perform 3D EM simulation and SI/PI analysis of package transitions.
• Correlate simulation results with laboratory measurements.
• Contribute to the definition and evolution of package ADKs and reusable libraries.

Skills

High-speed IC package design

Electromagnetics

Signal Integrity

Power Integrity

3D EM simulation

Python

Tcl

Education

MS or PhD in Electrical Engineering

Tools

HFSS

CST

ADS

Allegro XP

APD

Xpedition

Job description

NOKIA is seeking a High-Speed Package Design Engineer based in New Providence, New Jersey. This role involves leading the design, simulation, and validation of advanced IC packages for RF and mixed-signal systems. Candidates should hold an MS or PhD in Electrical Engineering and have over 5 years of relevant experience.

The successful candidate will work on design methodologies, team integration, and contribute to technology files and verification flows. Strong skills in electromagnetics and signal integrity are essential.