Lead Electroplating Engineer for Semiconductors

Arizona State University; Mesa (AZ); On-site; USD 110,000 - 150,000; Full time

Job summary

Arizona State University seeks a Principal Plating Engineer to lead electroplating process development for a forthcoming 300mm wafer plating system. You will own chemical metrology systems and work with cross-disciplinary teams to ensure robust processes meeting precise electrical and physical specs.

You will support operations to increase uptime, resolve production issues, and improve yields, while developing new processes and IP.

Qualifications

• Bachelor's degree and seven (7) years of related experience or equivalent.
• Experience with electroplating processing equipment and processes.
• Strong communication and customer service skills.

Responsibilities

• Maintain electroplating equipment and improve up time and yield.
• Assist students, faculty, and professionals with service requests.
• Procure and install future equipment for the Core facility.
• Cross-train to provide backup across areas.
• Write safe operating procedures for equipment users.
• Supervise Core users and junior engineers.
• Respond to production issues and reduce costs.
• Use SPC and data analysis to monitor equipment performance.

Skills

Electroplating processing

Statistical analysis

Communication

Customer service

Mechanical aptitude

Education

Bachelor's degree

Master’s degree in engineering or related field

MS in Chemical Engineering or related discipline

Tools

JMP

Minitab

Job description

Arizona State University seeks a Principal Plating Engineer to lead electroplating process development for a forthcoming 300mm wafer plating system. You will own chemical metrology systems and work with cross-disciplinary teams to ensure robust processes meeting precise electrical and physical specs.

You will support operations to increase uptime, resolve production issues, and improve yields, while developing new processes and IP.