Cu Plating Process Engineer for 28nm CMOS Ramp

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 90,000 - 120,000; Full time

Job summary

LFAB (Lehi Fab) in Utah is seeking an experienced Manufacturing Process Engineer focused on Cu plating. You will join a team driving sustainment, development and transfer of plating processes for high-volume 300mm wafer production.

The role emphasizes supporting operations, startup executions, SWRs, data-driven process improvements, and cross-functional collaboration to boost yields and efficiency across Analog Technologies and 28nm CMOS planar tech.

Qualifications

• 3 years of experience in Electroplating/Plating within the semiconductor industry.
• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a related field.
• Strong foundation in statistical process control, engineering change control and process release strategies.

Responsibilities

• Join the team of dynamic engineers that work on process sustenance, development and transfer
• Support manufacturing operations
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
• Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
• Participate in data analysis and problem resolution
• Support 28nm CMOS Planar technology

Skills

Cu Plating

Process Engineering

Statistical Process Control

Problem Solving

Data Analysis

Education

Bachelor's degree in Chemical Engineering or related field

Job description

LFAB (Lehi Fab) in Utah is seeking an experienced Manufacturing Process Engineer focused on Cu plating. You will join a team driving sustainment, development and transfer of plating processes for high-volume 300mm wafer production.

The role emphasizes supporting operations, startup executions, SWRs, data-driven process improvements, and cross-functional collaboration to boost yields and efficiency across Analog Technologies and 28nm CMOS planar tech.