Process Engineering Intern - Electroplating & Wafers

Lam Research; Tualatin (OR); Hybrid; USD 110,000 - 170,000; Full time

Benefits offered by this job

Hybrid work model

Comprehensive benefits

Job summary

Lam Research is seeking a highly motivated candidate to join the WETS team on the Sabre 3D process development and engineering efforts, focusing on electrodeposition in advanced packaging.

You will apply electrochemical plating knowledge, model and simulate processes, run bench-scale experiments, analyze data, and help translate lab results into robust manufacturing processes for improved wafer deposition performance.

Qualifications

• Hands-on experience in a wet laboratory.
• Experience troubleshooting complex equipment and systems.
• Knowledge of electrochemistry, copper, tin and tin-alloys, nickel electrodeposition.
• Experience with modeling and simulation to support process understanding and optimization.
• Solid understanding of grain growth mechanisms and microstructure evolution.

Responsibilities

• Develop features on Lam SABRE 3D system to improve equipment and reactor performance.
• Set up and run bench-scale experiments and operate deposition development tools.
• Compile data and perform literature research to support technology development.

Skills

Modeling & simulation

Electroplating processes

Electrochemistry

Grain growth knowledge

Lab bench experience

Problem solving

Education

Master’s or PhD in Chemical Engineering, Chemistry, Mechanical Engineering, or Materials Science

Job description

Lam Research is seeking a highly motivated candidate to join the WETS team on the Sabre 3D process development and engineering efforts, focusing on electrodeposition in advanced packaging.

You will apply electrochemical plating knowledge, model and simulate processes, run bench-scale experiments, analyze data, and help translate lab results into robust manufacturing processes for improved wafer deposition performance.