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EnaChip is seeking an Electroplating Engineer to define, optimize, and own plating processes for magnetic alloy deposition in a production-forward environment on site in Philadelphia. You will scale processes from R&D to wafer- and panel-level manufacturing, collaborating with materials and design teams to achieve targeted conductor and magnetic properties.
Ideal candidates have 3–5 years in electroplating within semiconductor or advanced manufacturing settings, plus a degree in materials
EnaChip is seeking an Electroplating Engineer to define, optimize, and own plating processes for magnetic alloy deposition in a production-forward environment on site in Philadelphia. You will scale processes from R&D to wafer- and panel-level manufacturing, collaborating with materials and design teams to achieve targeted conductor and magnetic properties.
Ideal candidates have 3–5 years in electroplating within semiconductor or advanced manufacturing settings, plus a degree in materials