Principal Electroplating Engineer - Wafer Processing

Arizona State University; Tempe (AZ); On-site; USD 135,000 - 175,000; Full time

Job summary

Arizona State University’s Advanced Electronics and Photonics Core Facility seeks a Principal Plating Engineer to lead electroplating process development for a 300mm wafer system. You will collaborate with device physics, deposition, etching, photolithography, and test teams to ensure robust processes meeting stringent specifications.

The role emphasizes equipment uptime, process improvement, and intellectual property development, with direct interaction with students, faculty, and

Qualifications

• Bachelor's degree and seven years of related experience or equivalent combination.

Responsibilities

• Develop electroplating processes for a forthcoming 300mm wafer plating system.
• Own chemical metrology systems and ensure robust processes meeting specs.
• Support operations to maximize equipment uptime and respond to production issues.
• Collaborate with device physics, deposition, etching, photolithography, and test teams.
• Provide customer service to students, faculty, and professionals.

Skills

Project leadership

Technical guidance

Cross-disciplinary collaboration

Statistical analysis

Education

Bachelor's degree

Master’s degree in engineering or related field

Tools

JMP

Minitab

Job description

Arizona State University’s Advanced Electronics and Photonics Core Facility seeks a Principal Plating Engineer to lead electroplating process development for a 300mm wafer system. You will collaborate with device physics, deposition, etching, photolithography, and test teams to ensure robust processes meeting stringent specifications.

The role emphasizes equipment uptime, process improvement, and intellectual property development, with direct interaction with students, faculty, and