Lead C2C Bonding Engineer - Hybrid Wafer Integration

Samsung Electronics Perú; Austin (TX); On-site; USD 131,000 - 206,000; Full time

Benefits offered by this job

Medical, dental, vision insurance

Life insurance + 401(k) matching

Onsite cafe and gym facilities

Paid maternity/paternity leave

PTO + holidays

Job summary

Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and integration of advanced wafer bonding technologies for next-generation CIS. You will drive innovations in hybrid bonding to enable stacked image sensors with improved yield and reliability, on-site in Austin.

The role requires 5+ years in Far BEOL/Module Integration and 3+ years in Bonding, with up to 10+ years in related areas.

Qualifications

• Bachelor’s degree in a relevant engineering field.
• 5+ years in Far BEOL Process/Module Integration in semiconductor manufacturing.
• 3+ years of Bonding experience required; 10+ years preferred.

Responsibilities

• Enable 1st of a kind C2C bonding process at Samsung Austin.
• Own module integration for bonding and far BEOL steps.
• Lead projects to cure systematics and improve detection.
• Own critical dimension targeting and variation control.
• Review yield, cost, throughput changes across the factory.

Skills

Bonding

C2C Bonding

Module Integration

Yield Optimization

Process Flow

Education

Bachelor’s Degree (Electrical, Chemical, Materials Science, Physics, Chemistry)

Job description

Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and integration of advanced wafer bonding technologies for next-generation CIS. You will drive innovations in hybrid bonding to enable stacked image sensors with improved yield and reliability, on-site in Austin.

The role requires 5+ years in Far BEOL/Module Integration and 3+ years in Bonding, with up to 10+ years in related areas.