C2C Bonding & BEOL Module Integration Lead

Bzpp; United States; On-site; USD 106,000 - 145,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

Life insurance and 401(k) matching

Onsite cafe and fitness facilities

Job summary

Samsung Austin Semiconductor seeks a Hybrid C2C - BEOL Module Integration Engineer to lead development, optimization, and manufacturing integration of advanced wafer bonding for next-generation CMOS Image Sensors. You will own module integration for bonding and farBEOL steps, drive yield and reliability improvements, and guide CD targets across the process flow.

This role requires a BS plus 5+ years in Far BEOL and 3+ years in bonding, with 10+ years in process/integration preferred.

Qualifications

• Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field.
• 5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience.
• 10+ years of experience in Process/Module Integration highly preferred.
• Expert understanding of overall process flow and interactions between process and yield, product performance and reliability.
• Knowledge of fab unit processes (Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) is highly preferred.

Responsibilities

• Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
• Own all Systematic Yield/Reliability related issues for these steps.
• Lead projects to cure these systematics from the technology and/or improve detection for them.
• Own critical dimension targeting and variation control within the Module.
• Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
• Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills

Bonding

Wafer Bonding

C2C Bonding

Module Integration

Yield/Reliability

Process Flow

Education

Bachelor’s Degree or higher in Electrical Eng., Chemical Eng., Materials Sci., Physics, Chemistry or related field

Job description

Samsung Austin Semiconductor seeks a Hybrid C2C - BEOL Module Integration Engineer to lead development, optimization, and manufacturing integration of advanced wafer bonding for next-generation CMOS Image Sensors. You will own module integration for bonding and farBEOL steps, drive yield and reliability improvements, and guide CD targets across the process flow.

This role requires a BS plus 5+ years in Far BEOL and 3+ years in bonding, with 10+ years in process/integration preferred.