[Samsung Electronics America] CVD Process Engineer - Wafer Bonding 채용

Samsung Electronics America; United States; On-site; USD 70,000 - 179,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) matching

Onsite facilities

Job summary

Samsung Austin Semiconductor is seeking an experienced engineer to provide technical leadership in wafer bonding and de-bonding. You will design experiments, analyze bonding quality, troubleshoot issues, and document process parameters for 24/7 operation.

You will lead equipment setup, maintain tool matching, and drive continuous improvement with cross-functional teams. The role requires at least 5 years in fab equipment and wafer bonding, with a Bachelor's in engineering.

Qualifications

• Bachelor's degree in Engineering or a related technical discipline.
• Minimum 5 years of Fab Equipment management experience.
• Minimum 3 years in wafer bonding and debonding equipment.
• Experience in the semiconductor environment or high-volume manufacturing.
• Strong problem-solving and data analysis skills.
• Ability to manage multiple projects and milestones.

Responsibilities

• Lead bonding equipment setup, operation, and maintenance.
• Troubleshoot bonding/debonding issues and implement corrective actions.
• Drive continuous improvement for bonding yield and throughput.
• Collaborate with cross-functional teams and vendors.
• Provide operator training and knowledge transfer.

Skills

Hybrid bonding

Data analysis

Project management

Teamwork

Clean room

Fast paced

Education

Bachelor's degree in Engineering or a related technical discipline

Tools

VBA

Python

R

SQL

Job description

About Samsung Austin Semiconductor Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us!

Position Summary

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintain detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and to ensure smooth 24/7 wafer bonding operation.

Role and Responsibilities

Equipment Setup and Operation

• Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements
• Ensure tool-to-tool matching across fabs and between tools
• Develop and maintain preventive maintenance schedules and procedures
• Ensure bonding meets device and process output specifications
• Successfully transfer and qualify process from development fab to HVM facility

Technical Troubleshooting

• Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans
• Provide clear updates and instructions to users and management regarding ongoing issues and resolutions
• Maintain FMEA and manage RPN reduction activity

Equipment and Process Continuous Improvement

• Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput
• Collaborate with vendors in evaluation and qualification on new bonding and de-bonding techniques

Talent Development

• Providing technical support and training to operators and technicians on equipment operation and procedures
• Present key technical developments to SAS technical staff and management

Skills and Qualifications

• Knowledge and familiarity with hybrid bonding techniques and equipment
• Bachelor’s degree in Engineering or a related technical discipline
• Minimum of 5 years of engineering experience in Fab Equipment management
• Minimum of 3 years in experience in wafer bonding and de-bonding equipment
• Experience in the semiconductor environment or in high volume advanced manufacturing
• Desire to take on technical challenges and shifting priorities in a fast paced cutting edge environment
• Able to work with others in a team-oriented culture
• Experience with data analysis: able to quickly analyze, summarize, and present data in an easy to understand format
• Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long term projects with daily sustaining.
• Ability to rapidly come up to speed with new computer applications and systems
• Able to work for several hours per day in a clean room environment

Desired Knowledge/Skills but not required

• Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.
• Ability to manipulate and interpret equipment sensor data for the purpose of advanced equipment troubleshooting and setting up of controls for equipment sensors
• VBA, Python, R, SQL, or other basic programming

Salary and Compensation

The current base salary range for this role is between $70,480- $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards and Benefits

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives and MORE
• Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control Compliance

This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets Notice

By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.