C2C Bonding Engineer

Samsung Electronics America; Austin (TX); On-site; USD 131,000 - 206,000; Full time

Benefits offered by this job

Medical, dental, vision insurance

Life insurance + 401(k) matching

Onsite cafe and gym facilities

Paid maternity/paternity leave

PTO + holidays

Job summary

Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and integration of advanced wafer bonding technologies for next-generation CIS. You will drive innovations in hybrid bonding to enable stacked image sensors with improved yield and reliability, on-site in Austin.

The role requires 5+ years in Far BEOL/Module Integration and 3+ years in Bonding, with up to 10+ years in related areas.

Qualifications

• Bachelor’s degree in a relevant engineering field.
• 5+ years in Far BEOL Process/Module Integration in semiconductor manufacturing.
• 3+ years of Bonding experience required; 10+ years preferred.

Responsibilities

• Enable 1st of a kind C2C bonding process at Samsung Austin.
• Own module integration for bonding and far BEOL steps.
• Lead projects to cure systematics and improve detection.
• Own critical dimension targeting and variation control.
• Review yield, cost, throughput changes across the factory.

Skills

Bonding

C2C Bonding

Module Integration

Yield Optimization

Process Flow

Education

Bachelor’s Degree (Electrical, Chemical, Materials Science, Physics, Chemistry)

Job description

## C2C Bonding EngineerApplyremote type: On-sitelocations: 12100 Samsung Blvd, Austin, TX, USAtime type: Full timeposted on: Posted Todaytime left to apply: End Date: December 31, 2026 (30+ days left to apply)job requisition id: R119383**About Samsung Austin Semiconductor** Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.**Come innovate with us!****Position Summary**In your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS). You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.**Role and Responsibilities****Here's what you'll be responsible for:*** Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.* Own all Systematic Yield/Reliability related issues for these steps.* Lead projects to cure these systematics from the technology and/or improve detection for them.* Own critical dimension targeting and variation control within the Module.* Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.* Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.**Skills and Qualifications**Here's what you'll need:* Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field* 5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.* Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.* Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.*The current base salary range for this role is between $131,000 - $206,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.***Total Rewards** At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.We offer a comprehensive benefits package, including:* Medical, dental, and vision insurance* Life insurance and 401(k) matching with immediate vesting* Onsite café(s) and workout facilities* Paid maternity and paternity leave* Paid time off (PTO) + 2 personal holidays and 10 regular holidays* Wellness incentives and MOREEligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.All positions at Samsung Austin Semiconductor are full-time on-site.**U.S. Export Control Compliance** This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.**Trade Secrets Notice** By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.\* Please visit Samsung membership to see Privacy Policy, which defaults according to your location. You can change Country/Language at the bottom of the page. If you are European Economic Resident, please click here. \* Samsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.