[Samsung Electronics America] Hybrid C2C - BEOL Module Integration Engineer 채용

Bzpp; United States; On-site; USD 106,000 - 145,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

Life insurance and 401(k) matching

Onsite cafe and fitness facilities

Job summary

Samsung Austin Semiconductor seeks a Hybrid C2C - BEOL Module Integration Engineer to lead development, optimization, and manufacturing integration of advanced wafer bonding for next-generation CMOS Image Sensors. You will own module integration for bonding and farBEOL steps, drive yield and reliability improvements, and guide CD targets across the process flow.

This role requires a BS plus 5+ years in Far BEOL and 3+ years in bonding, with 10+ years in process/integration preferred.

Qualifications

• Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field.
• 5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience.
• 10+ years of experience in Process/Module Integration highly preferred.
• Expert understanding of overall process flow and interactions between process and yield, product performance and reliability.
• Knowledge of fab unit processes (Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) is highly preferred.

Responsibilities

• Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
• Own all Systematic Yield/Reliability related issues for these steps.
• Lead projects to cure these systematics from the technology and/or improve detection for them.
• Own critical dimension targeting and variation control within the Module.
• Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
• Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills

Bonding

Wafer Bonding

C2C Bonding

Module Integration

Yield/Reliability

Process Flow

Education

Bachelor’s Degree or higher in Electrical Eng., Chemical Eng., Materials Sci., Physics, Chemistry or related field

Job description

About Samsung Austin SemiconductorSamsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us!Position SummaryIn your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS). You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.Role and ResponsibilitiesHere's what you'll be responsible for:Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.Own all Systematic Yield/Reliability related issues for these steps.Lead projects to cure these systematics from the technology and/or improve detection for them.Own critical dimension targeting and variation control within the Module.Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.Skills and QualificationsHere's what you'll need:Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.The current base salary range for this role is between $106,000.00 - $145,000.00. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.Total RewardsAt Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.We offer a comprehensive benefits package, including:Medical, dental, and vision insuranceLife insurance and 401(k) matching with immediate vestingOnsite café(s) and workout facilitiesPaid maternity and paternity leavePaid time off (PTO) + 2 personal holidays and 10 regular holidaysWellness incentives and MOREEligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.All positions at Samsung Austin Semiconductor are full-time on-site.Trade SecretsBy submitting an application, you agree not to disclose to Samsung or induce or encourage Samsung to use any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

Hybrid C2C - BEOL Module Integration Engineer

Hybrid C2C - BEOL Module Integration Engineer

기술개발 | 공정엔지니어 품질관리 생산관리 반도체

• C2C Bonding
• BEOL Module Integration
• Wafer Bonding
• Semiconductor Manufacturing
• Yield/Reliability
• 접수기간2026.10.02 ~ 2027.10.01 D-334

About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

Come innovate with us!

Position Summary

In your role as a Copper-to-Copper (C2C) Bonding Expert, you'll be responsible to lead the development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CMOS Image Sensors (CIS).
You'll use your expertise to drive innovations in hybrid bonding processes enabling stacked image sensors with superior yield, performance and reliability.

Role and Responsibilities

Here's what you'll be responsible for:

• Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
• Own all Systematic Yield/Reliability related issues for these steps.
• Lead projects to cure these systematics from the technology and/or improve detection for them.
• Own critical dimension targeting and variation control within the Module.
• Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
• Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills and Qualifications

Here's what you'll need:

• Bachelor’s Degree (or higher) in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field
• 5+ years of experience in Far BEOL Process/Module Integration in semiconductor manufacturing + 3+ years of Bonding experience is required. 10+ years of experience in Process/Module Integration highly preferred.
• Expert understanding of overall process flow in assigned areas - Demonstrated understanding of the interactions between process and yield, product performance and reliability.
• Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.

The current base salary range for this role is between $106,000.00 - $145,000.00. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards
At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives and MORE
  

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

Trade Secrets
By submitting an application, you agree not to disclose to Samsung or induce or encourage Samsung to use any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.