C2C Bonding Module Architect

Samsung Electronics America; Austin (TX); On-site; USD 106,000 - 145,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

Life insurance

401(k) matching with immediate vesting

Onsite café(s) and workout facilities

Paid maternity and paternity leave

PTO and holidays

Wellness incentives

Job summary

Samsung Austin Semiconductor in Austin, TX seeks a Copper-to-Copper Bonding Expert to lead development and optimization of advanced wafer bonding for CMOS image sensors. You will enable first-of-a-kind C2C bonding and drive process integration to improve yield, performance and reliability.

You will own module integration, yield and reliability issues, lead projects to cure systematics, and guide changes reviewed by Change Control Board.

Qualifications

• Bachelor’s degree in Electrical/Chemical/Materials Physics or Chemistry.
• 5+ years BEOL/Module Integration in semiconductor manufacturing + 3+ years Bonding experience.
• 10+ years of Process/Module Integration highly preferred.
• Expert understanding of overall process flow and interactions with yield, product performance and reliability.
• Knowledge of fab unit processes (Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP).

Responsibilities

• Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
• Own all Systematic Yield/Reliability related issues for these steps.
• Lead projects to cure these systematics from the technology and/or improve detection for them.
• Own critical dimension targeting and variation control within the Module.
• Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
• Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills

Bonding experience

Module Integration

Yield/Reliability focus

Process flow understanding

Education

Bachelor’s Degree in EE/CE/Materials/Physics/Chemistry

Tools

Lithography

Etch

Diffusion

Thin Films Deposition

Wet Cleans

CMP

Job description

Samsung Austin Semiconductor in Austin, TX seeks a Copper-to-Copper Bonding Expert to lead development and optimization of advanced wafer bonding for CMOS image sensors. You will enable first-of-a-kind C2C bonding and drive process integration to improve yield, performance and reliability.

You will own module integration, yield and reliability issues, lead projects to cure systematics, and guide changes reviewed by Change Control Board.