C2C Bonding Engineer - Lead Next-Gen Image Sensor Tech

Samsung Semiconductor; Austin (TX); On-site; USD 131,000 - 206,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) matching

Onsite facilities

Parental leave

PTO and holidays

Wellness incentives

Job summary

Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and manufacturing integration of advanced wafer bonding for next-gen CIS. You will drive innovations in hybrid bonding processes enabling stacked image sensors with improved yield, performance, and reliability.

The role requires overseeing 1st-of-a-kind C2C bonding, owning yield/reliability issues, and leading projects to cure systematics and optimize module targets.

Qualifications

• 5+ years in Far BEOL Process/Module Integration in semiconductor manufacturing
• 3+ years of Bonding experience
• 10+ years in Process/Module Integration preferred
• Knowledge of fab unit processes (Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP)

Responsibilities

• Enable 1st of a kind C2C bonding process at Samsung Austin - Own Module Integration for Bonding and farBEOL steps within the Process flow.
• Own all Systematic Yield/Reliability related issues for these steps.
• Lead projects to cure these systematics from the technology and/or improve detection for them.
• Own critical dimension targeting and variation control within the Module.
• Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
• Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills

Bonding experience

Process/Module Integration

Yield analysis

Fab process knowledge

Education

Bachelor's degree or higher in Electrical Engineering

Tools

Bonding equipment knowledge

Process control software

Job description

Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and manufacturing integration of advanced wafer bonding for next-gen CIS. You will drive innovations in hybrid bonding processes enabling stacked image sensors with improved yield, performance, and reliability.

The role requires overseeing 1st-of-a-kind C2C bonding, owning yield/reliability issues, and leading projects to cure systematics and optimize module targets.