Lead ASIC Physical Design Engineer - RTL to Tapeout

Quest Global; Santa Clara (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Quest Global is seeking an experienced semiconductor PD engineer to drive RTL-to-tapeout ASIC/SoC design in Santa Clara. You will execute full‑chip Physical Design, Synthesis, Timing Closure, and CTS, collaborating closely with RTL, Verification, and Architecture teams.

The role demands hands‑on use of industry tools such as Innovus, strong scripting in TCL/Perl, and expertise in Floorplanning, Place & Route, and EM/IR analysis to ensure robust, power‑efficient designs.

Qualifications

• Experience with physical design flows from RTL to tape-out.
• Strong expertise in timing closure and STA.
• Hands-on EDA tool experience (Innovus).

Responsibilities

• Execute full-chip Physical Design, Synthesis, Physical Verification, and Timing Closure
• Setup and synthesize RTL designs
• Drive timing closure using advanced optimization techniques, with strong expertise in Top-Level STA
• Perform EM/IR Analysis and power integrity validation
• Execute Place & Route activities for complex SoCs
• Lead Clock Tree Synthesis (CTS), custom clock tree implementation, skew balancing, and insertion delay optimization
• Handle Floorplanning and Layout, including top-level floorplan architecture and implementation
• Develop and improve physical design flows, methodologies, and automation
• Collaborate closely with RTL, Design, Verification, and Architecture teams

Skills

RTL-to-Tapeout PD

Top-Level STA

EM/IR Analysis

Place & Route

CTS

Floorplanning

Layout

TCL/Perl scripting

Tools

Innovus

Job description

Quest Global is seeking an experienced semiconductor PD engineer to drive RTL-to-tapeout ASIC/SoC design in Santa Clara. You will execute full‑chip Physical Design, Synthesis, Timing Closure, and CTS, collaborating closely with RTL, Verification, and Architecture teams.

The role demands hands‑on use of industry tools such as Innovus, strong scripting in TCL/Perl, and expertise in Floorplanning, Place & Route, and EM/IR analysis to ensure robust, power‑efficient designs.