Lead 3D/Hybrid Integration Process Engineer

TOKYO ELECTRON AMERICA, INC.; City of Albany (NY); On-site; USD 123,806 - 174,945; Full time

Benefits offered by this job

Medical, Vision, and Dental Insurance

Paid Personal Leave

Holiday Time

401k Retirement Plans and Employer/ROE

Tuition Reimbursement

Incentives for Healthy Lifestyles

Employee Assistance Programs

Job summary

TOKYO ELECTRON AMERICA, INC. in Albany, NY is seeking a Senior Heterogeneous Integration Process Engineer to lead R&D in 3DI technologies. You will drive wafer bonding, C2W/D2W approaches, and innovative process development with cross-functional teams, customers, and TEL’s global R&D network.

The role demands a PhD and 5+ years in semiconductor R&D, plus strong communication and project leadership to advance device integration roadmaps and deliver industry-leading solutions.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on wafer bonding, process integration, or related semiconductor technologies.
• Excellent verbal and written communication skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Demonstrated leadership in cross-functional technical programs.
• Ability to work effectively in a multicultural and global environment.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Skills

Wafer bonding

Process integration

Advanced packaging

Heterogeneous integration

3D device integration

Leadership

Communication

Project management

Education

Ph.D. in Materials Science / Mechanical / Chemical / Electrical Eng / Physics / Chemistry / Nanotechnology

Job description

TOKYO ELECTRON AMERICA, INC. in Albany, NY is seeking a Senior Heterogeneous Integration Process Engineer to lead R&D in 3DI technologies. You will drive wafer bonding, C2W/D2W approaches, and innovative process development with cross-functional teams, customers, and TEL’s global R&D network.

The role demands a PhD and 5+ years in semiconductor R&D, plus strong communication and project leadership to advance device integration roadmaps and deliver industry-leading solutions.