Senior Heterogenous Integration Process Engineer

Tokyo Electron; New York (NY); On-site; USD 124,000 - 175,000; Full time

Benefits offered by this job

Medical, Vision, and Dental Insurance

401k Retirement Plans and Employer Rec

Tuition Reimbursement

Paid Personal Leave

Holiday Time

Employee Assistance Programs

Job summary

Tokyo Electron's TEL Technology Center, America (TTCA) in Albany, NY, seeks a Senior Heterogeneous Integration Process Engineer to drive next-generation 3D device integration and advanced packaging projects.

You will lead R&D programs in C2W, D2W, and wafer bonding, shape technical strategy, collaborate with global teams and customers, mentor researchers, and deliver innovative processes and hardware solutions. Travel up to 20% is expected.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Skills

Semiconductor R&D

Heterogeneous integration

Wafer bonding

Project management

Communication

Education

PhD in Materials Science or related field

Job description

Job Description Senior Heterogenous Integration Process Engineer

Location of position: Albany, NY TEL Technology Center, America (TTCA) is TEL's advanced R&D center in the United States, driving innovation in next-generation semiconductor process technologies and equipment solutions. Leveraging expertise in semiconductor processing, materials science, device integration, and equipment engineering, TTCA collaborates with customers, research institutions, and TEL's global R&D network to solve critical technology challenges. From concept development to manufacturing enablement, our team develops innovative solutions that support future semiconductor technology roadmaps and advance semiconductor manufacturing worldwide.

Group/Role Overview

The 3DI Technology Group at TEL Technology Center, America (TTCA) develops next-generation heterogeneous integration and 3D device integration technologies for future semiconductor applications. Our focus includes fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies, enabling advanced architecture such as bonded-CFET, VCT DRAM, and 3D-stacked memory and logic devices. As a 3DI R&D Engineer, you will lead the development of innovative process and equipment solutions through fundamental research, process development, and technology pathfinding. Working closely with leading customers, research partners, and TEL's global R&D teams, you will help define and enable the next generation of semiconductor integration technologies.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.
• Ability to work effectively in a multicultural and global environment.

Travel: up to 20%

Benefits

• Medical, Vision, and Dental Insurance
• Paid Personal Leave
• Holiday Time
• 401k Retirement Plans and Employer Matching
• Tuition Reimbursement
• Incentives for Healthy Lifestyles
• Employee Assistance Programs

Equal Opportunity Employer/Minorities/Females/Disabled/Veterans

Salary Ranges

$123,806.02 - $174,945.55

Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

Subsidiary TOKYO ELECTRON AMERICA, INC. We make innovation possible. At TEL, we’re committed to advancing future technologies and success starts with a community of talented individuals. Our global workforce of over 20,000 employees is embracing the challenge of a rapidly evolving tech landscape. Your growth fuels our progress. Our 360-degree learning approach ensures there’s something for every style from interactive classes and on the job training to formal programs led by certified technical experts and organizational development professionals. You’ll continue building your skills and nurturing your curiosity. To support your journey, TEL offers educational reimbursement to help you reach your learning goals.

Diversity Statement

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affirmative Action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.