Lead 3D IC Integration & Bonding Process Engineer

Tokyo Electron; City of Albany (NY); On-site; USD 123,806 - 174,945; Full time

Benefits offered by this job

Medical, Vision, and Dental Insurance

Paid Personal Leave

Holiday Time

401k Retirement Plans and Employer M

Tuition Reimbursement

Incentives for Healthy Lifestyles

Employee Assistance Programs

Job summary

Tokyo Electron TTCA in Albany, NY, seeks a Senior Heterogeneous Integration Process Engineer to lead R&D programs advancing 3D device integration, C2W and wafer bonding, and to partner with customers and TEL's global teams.

You will define technical strategy, mentor researchers, perform modeling and experiments, and drive innovation with strong communication and cross‑functional leadership. This on‑site role offers a competitive salary, plus medical, retirement, and education benefits.

Qualifications

• Ph.D. in a related field.
• 5+ years semiconductor R&D experience.
• Expert in advanced packaging and 3D integration.
• Hands-on wafer bonding and process integration.
• Strong problem-solving and analytical skills.
• Proven leadership in cross-functional programs.
• Excellent communication, oral and written.
• Global/cross-cultural collaboration experience.

Responsibilities

• Lead R&D programs in 3DI technologies including C2W and wafer bonding.
• Define technical strategy and align R&D with business goals.
• Collaborate with global teams, customers, and partners.
• Conduct fundamental research and develop processes and hardware.
• Evaluate feasibility through modeling, simulation, and experiments.
• Drive technology pathfinding for heterogeneous and 3D integration.
• Mentor researchers and foster technical excellence.
• Provide technical leadership for customer engagements.
• Communicate results and recommendations to stakeholders.

Skills

Heterogeneous integration

3D device integration

Project management

Communication

Leadership

Problem solving

Education

PhD in related field

Job description

Tokyo Electron TTCA in Albany, NY, seeks a Senior Heterogeneous Integration Process Engineer to lead R&D programs advancing 3D device integration, C2W and wafer bonding, and to partner with customers and TEL's global teams.

You will define technical strategy, mentor researchers, perform modeling and experiments, and drive innovation with strong communication and cross‑functional leadership. This on‑site role offers a competitive salary, plus medical, retirement, and education benefits.