Senior 3DI Process Engineer: Heterogeneous & 3D Integration

Tokyo Electron; New York (NY); On-site; USD 124,000 - 175,000; Full time

Benefits offered by this job

Medical, Vision, and Dental Insurance

401k Retirement Plans and Employer Rec

Tuition Reimbursement

Paid Personal Leave

Holiday Time

Employee Assistance Programs

Job summary

Tokyo Electron's TEL Technology Center, America (TTCA) in Albany, NY, seeks a Senior Heterogeneous Integration Process Engineer to drive next-generation 3D device integration and advanced packaging projects.

You will lead R&D programs in C2W, D2W, and wafer bonding, shape technical strategy, collaborate with global teams and customers, mentor researchers, and deliver innovative processes and hardware solutions. Travel up to 20% is expected.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Skills

Semiconductor R&D

Heterogeneous integration

Wafer bonding

Project management

Communication

Education

PhD in Materials Science or related field

Job description

Tokyo Electron's TEL Technology Center, America (TTCA) in Albany, NY, seeks a Senior Heterogeneous Integration Process Engineer to drive next-generation 3D device integration and advanced packaging projects.

You will lead R&D programs in C2W, D2W, and wafer bonding, shape technical strategy, collaborate with global teams and customers, mentor researchers, and deliver innovative processes and hardware solutions. Travel up to 20% is expected.