Senior Heterogenous Integration Process Engineer

Tokyo Electron; City of Albany (NY); On-site; USD 123,806 - 174,945; Full time

Benefits offered by this job

Medical, Vision, and Dental Insurance

Paid Personal Leave

Holiday Time

401k Retirement Plans and Employer M

Tuition Reimbursement

Incentives for Healthy Lifestyles

Employee Assistance Programs

Job summary

Tokyo Electron TTCA in Albany, NY, seeks a Senior Heterogeneous Integration Process Engineer to lead R&D programs advancing 3D device integration, C2W and wafer bonding, and to partner with customers and TEL's global teams.

You will define technical strategy, mentor researchers, perform modeling and experiments, and drive innovation with strong communication and cross‑functional leadership. This on‑site role offers a competitive salary, plus medical, retirement, and education benefits.

Qualifications

• Ph.D. in a related field.
• 5+ years semiconductor R&D experience.
• Expert in advanced packaging and 3D integration.
• Hands-on wafer bonding and process integration.
• Strong problem-solving and analytical skills.
• Proven leadership in cross-functional programs.
• Excellent communication, oral and written.
• Global/cross-cultural collaboration experience.

Responsibilities

• Lead R&D programs in 3DI technologies including C2W and wafer bonding.
• Define technical strategy and align R&D with business goals.
• Collaborate with global teams, customers, and partners.
• Conduct fundamental research and develop processes and hardware.
• Evaluate feasibility through modeling, simulation, and experiments.
• Drive technology pathfinding for heterogeneous and 3D integration.
• Mentor researchers and foster technical excellence.
• Provide technical leadership for customer engagements.
• Communicate results and recommendations to stakeholders.

Skills

Heterogeneous integration

3D device integration

Project management

Communication

Leadership

Problem solving

Education

PhD in related field

Job description

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Senior Heterogenous Integration Process Engineer

Location of position: Albany, NY

TEL Technology Center, America (TTCA) is TEL's advanced R&D center in the United States, driving innovation in next-generation semiconductor process technologies and equipment solutions. Leveraging expertise in semiconductor processing, materials science, device integration, and equipment engineering, TTCA collaborates with customers, research institutions, and TEL's global R&D network to solve critical technology challenges. From concept development to manufacturing enablement, our team develops innovative solutions that support future semiconductor technology roadmaps and advance semiconductor manufacturing worldwide.

Group/Role Overview

The 3DI Technology Group at TEL Technology Center, America (TTCA) develops next-generation heterogeneous integration and 3D device integration technologies for future semiconductor applications. Our focus includes fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies, enabling advanced architecture such as bonded-CFET, VCT DRAM, and 3D-stacked memory and logic devices. As a 3DI R&D Engineer, you will lead the development of innovative process and equipment solutions through fundamental research, process development, and technology pathfinding. Working closely with leading customers, research partners, and TEL's global R&D teams, you will help define and enable the next generation of semiconductor integration technologies.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.
• Ability to work effectively in a multicultural and global environment.

Travel: up to 20%

Benefits:

• Medical, Vision, and Dental Insurance
• Paid Personal Leave
• Holiday Time
• 401k Retirement Plans and Employer Matching
• Tuition Reimbursement
• Incentives for Healthy Lifestyles
• Employee Assistance Programs

This job operates in an office setting. This role routinely uses standard office equipment such as computers, phones, photocopiers, and filing cabinets. This is a largely sedentary role; however, some filing is required, which would require the ability to lift files, open filing cabinets and bend or stand as necessary. This position requires the ability to occasionally lift office products and supplies, up to 35 pounds. This position also requires 4 to 6 hours per day at a computer screen/keyboard.

Equal Opportunity Employer/Minorities/Females/Disabled/Veterans

Salary Ranges

$123,806.02 - $174,945.55

Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer (full time regular employees ) a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable. The talent advisor can share more details about total compensation for the role in your location during the hiring process.

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affir…

Diversity creates an innovative culture. TEL US is an Equal Employment Opportunity / Affir…

Subsidiary

TOKYO ELECTRON AMERICA, INC.