Lead, 2.5D/3D Package Design & Customer Enablement

Rapidus Corporation US; Santa Clara (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Rapidus Corporation seeks a Customer Package Design Integration Engineer to drive chiplet-based product development using advanced packaging technologies. You will be the primary technical and program interface between Rapidus and customers, integrating ADKs, packaging tech, and customer design activities into a unified, successful outcome.

You will combine deep expertise in 2.5D/3D packaging with strong program management and cross-functional skills to drive designs from bring-up through

Qualifications

• B.S. or M.S. in EE, ME, or Materials Science.
• 5+ years in semiconductor packaging, system design, or customer-facing roles.
• Deep knowledge of 2.5D/3D packaging (interposer, TSV, RDL/fan-out).
• HBM, PCIe, UCIe, SerDes experience.
• Hands-on with Cadence, Ansys, Synopsys tools.
• Experience in managing complex programs.
• Strong communication and customer-facing skills.

Responsibilities

• Guide customers in applying package design rules, libraries, and interfaces.
• Advise on interposer and substrate architectures.
• Provide guidance on chiplet integration (HBM, UCIe, PCIe, SerDes).
• Drive projects to 2.5D/3D package design tape-out and realization.
• Manage design schedules, risks, milestones, and dependencies.
• Lead reviews with customers and internal teams.
• Coordinate across customer, ADK/Enablement, process, manufacturing, OSAT.
• Resolve SI/PI, layout, and ADK usage issues.
• Capture customer feedback to improve ADK and design flows.

Skills

2.5D/3D packaging

High-speed interfaces

Cadence tools

Customer-facing

Program mgmt

Communication

Education

Electrical Engineering

Mechanical Engineering

Materials Science

Tools

Cadence

Ansys

Synopsys

Job description

Rapidus Corporation seeks a Customer Package Design Integration Engineer to drive chiplet-based product development using advanced packaging technologies. You will be the primary technical and program interface between Rapidus and customers, integrating ADKs, packaging tech, and customer design activities into a unified, successful outcome.

You will combine deep expertise in 2.5D/3D packaging with strong program management and cross-functional skills to drive designs from bring-up through