Advanced Package Layout Architect - Multi-Die 2.5D/3D

Acceler8 Talent; Mountain View (CA); Vor Ort; USD 180.000 - 240.000; Vollzeit

Zusammenfassung

Acceler8 Talent is seeking an Advanced Package Layout Engineer to own multi-die 2.5D/3D package layout from bump-map planning through tape-out release. You will bridge silicone and board teams, guiding substrate suppliers and OSAT partners to manufacturable designs.

The role demands deep expertise in high-density routing, substrate stackups and power/ground delivery for high-current accelerator rails, with hands-on CAD tool experience and a drive to push packaging innovations to production.

Qualifikationen

• At least eight years of package layout experience on high-performance designs, including multi-die 2.5D and 3D packages.
• Deep expertise in substrate and interposer routing, high-density escape, stackup design and via structures.
• Experience with advanced packaging technologies such as CoWoS, EMIB, InFO, fan-out or equivalent interposer technologies.
• Hands-on ownership of package DRC/LVS, netlist verification and design release.
• Experience designing power and ground planes for high-current accelerator rails.

Aufgaben

• Own package substrate and interposer layout, including stackup definition, bump maps, RDL, escape routing and manufacturing release.
• Plan high-density routing and HBM-class channels alongside power/ground structures for accelerator rails.
• Collaborate with die floorplanning and PCB layout teams on interfaces and sign-off.
• Perform package DRC/LVS and coordinate with substrate suppliers and OSAT design rules.
• Work with architecture, SI/PI, thermo-mechanical and manufacturing teams to resolve trade-offs and achieve package sign-off.
• Develop and use AI-assisted tools to accelerate package layout, routing and sign-off.

Kenntnisse

Package layout

Multi-die 2.5D/3D

Advanced packaging technologies

Power/ground plane design

CAD tool familiarity

Tools

Cadence Allegro Package Designer

SiP Layout

Siemens Xpedition Package Designer

Jobbeschreibung

Acceler8 Talent is seeking an Advanced Package Layout Engineer to own multi-die 2.5D/3D package layout from bump-map planning through tape-out release. You will bridge silicone and board teams, guiding substrate suppliers and OSAT partners to manufacturable designs.

The role demands deep expertise in high-density routing, substrate stackups and power/ground delivery for high-current accelerator rails, with hands-on CAD tool experience and a drive to push packaging innovations to production.