Lead 2.5D/3D Chiplet Package Architect

Rapidus Corporation US; Santa Clara (CA); Vor Ort; USD 150.000 - 230.000; Vollzeit

Benefits dieser Stelle

Health, dental and vision coverage

Career growth opportunities

Global collaboration

Zusammenfassung

Rapidus Corporation US is seeking a Chiplet Package Design Engineer to drive 2.5D/3D heterogeneous integration across multiple locations, including Santa Clara, Albany, and beyond. You will collaborate with silicon design, OSAT partners, and manufacturing to deliver cutting-edge chiplet-based packaging solutions.

The role emphasizes synthesis and PnR in the digital reference flow, with adoption of AI-driven design space exploration and next‑gen automation tools.

Qualifikationen

• Bachelor's or Master's in EE, ME, Materials Science or related field.
• 5+ years in semiconductor package design, advanced packaging experience.
• Hands-on with 2.5D/3D packaging technologies (silicon interposer, TSV, hybrid bonding).
• Strong knowledge of high-speed interfaces and package-level SI/PI considerations.
• Experience with industry-standard tools like Cadence Allegro, Sigrity, Ansys HFSS.

Aufgaben

• Lead design and development of 2.5D/3D package architectures (interposer-based, fan-out, 3D stacking).
• Define and optimize chiplet integration strategies including die partitioning and interconnect topologies.
• Develop package layout and routing for high-density interconnects (HBM, UCIe, PCIe, SerDes).
• Perform SI, PI, and thermal analyses; guide reliability validation.

Kenntnisse

Chiplet packaging

2.5D/3D packaging

High-speed interfaces

SI/PI analysis

Cross-functional collaboration

Ausbildung

B.S./M.S. in Electrical/Mechanical Materials

Tools

Cadence Allegro Package Designer

Sigrity

Ansys HFSS

RedHawk-SC Electrothermal

Jobbeschreibung

Rapidus Corporation US is seeking a Chiplet Package Design Engineer to drive 2.5D/3D heterogeneous integration across multiple locations, including Santa Clara, Albany, and beyond. You will collaborate with silicon design, OSAT partners, and manufacturing to deliver cutting-edge chiplet-based packaging solutions.

The role emphasizes synthesis and PnR in the digital reference flow, with adoption of AI-driven design space exploration and next‑gen automation tools.