Memory Packaging Lead for 2.5D/3D Solutions

MediaTek; San Jose (CA); On-site; USD 180,000 - 272,000; Full time

Benefits offered by this job

Comprehensive health insurance

401(k)

Parental leave

Life and disability insurance

Job summary

MediaTek is searching for a visionary memory packaging technical leader to join their team in San Jose, CA. This role involves leading advanced 2.5D/3D packaging development for key business units including Datacenter, AI, and Automotive.

The candidate will oversee memory roadmap integration and manage critical relationships. A broad understanding of advanced packaging principles, coupled with supply chain management experience, is essential. Competitive salary range is $180,000 – $272,000.

Qualifications

• Comprehensive knowledge of advanced packaging and manufacturing process flows.
• Expert understanding of electrical Signal/Power Integrity (SI/PI) and thermal management.
• Experience in managing BOMs, procurement strategies, and logistics.

Responsibilities

• Lead memory roadmap development and package integration planning.
• Establish and manage relationships with memory vendors.
• Monitor project progress and communicate with stakeholders.

Skills

Memory Architecture & Process Expertise

Technical Leadership

Advanced Packaging Fundamentals

JEDEC Standard Mastery

Advanced Failure Analysis

Supply Chain & Partner Management

Job description

MediaTek is searching for a visionary memory packaging technical leader to join their team in San Jose, CA. This role involves leading advanced 2.5D/3D packaging development for key business units including Datacenter, AI, and Automotive.

The candidate will oversee memory roadmap integration and manage critical relationships. A broad understanding of advanced packaging principles, coupled with supply chain management experience, is essential. Competitive salary range is $180,000 – $272,000.