Laser Packaging Lead

Edison Smart®; California (MO); On-site; USD 160,000 - 240,000; Full time

Job summary

Edison Smart® is seeking a Senior Laser Packaging Engineer to own and scale the high-power laser packaging capability. This hands-on leadership role will build the packaging platform, stand up the cleanroom, develop processes, and assemble a team that takes devices from wafer/bar level through to reliable packaged hardware.

The role covers packaging across die attach, soldering, wire bonding, and thermal stack-ups, with a focus on reliable production.

Qualifications

• Hands-on semiconductor or laser packaging background.
• Experience with high-power laser bars, VCSEL, PCSEL or related devices.
• Experience taking hardware from prototype to repeatable production.

Responsibilities

• Own high-power laser packaging across die attach, solder processes, wire bonding, subcarriers and thermal stack-ups.
• Develop packaging processes and ensure qualification and reliability.
• Oversee cleanroom buildout, equipment selection and qualification.
• Design thermal management and packaging for high-power laser devices.
• Build and lead a team of packaging engineers and technicians.
• Move packaging from R&D/prototype builds toward repeatable production.
• Collaborate closely with device, materials, test and reliability teams.

Skills

Laser packaging

Team leadership

Thermal modeling

Prototype to production

Job description

I’m working with a rapidly scaling advanced hardware and engineering company looking to hire a Senior Laser Packaging Engineer to take ownership of its high power semiconductor laser packaging capability.

This is a hands-on technical leadership role with a broad mandate; build the packaging platform, stand up the cleanroom, develop the processes, and build the team that takes devices from wafer/bar level through to reliable packaged hardware.

The role will own:

• High-power laser packaging across die attach, solder processes, wire bonding, subcarriers and thermal stack-ups
• Packaging process development, qualification and reliability
• Cleanroom buildout, including equipment selection, installation and qualification
• Thermal management and package design for high-power laser devices
• Building and leading a team of packaging engineers and technicians
• Moving packaging from R&D/prototype builds toward repeatable production
• Working closely with device, materials, test and reliability engineering teams

Key experience:

• Strong hands-on semiconductor or laser packaging background
• High-power laser bars, VCSEL, PCSEL or closely related photonic devices
• Thermal modeling and high-heat-flux packaging
• Packaging process development and qualification
• Experience taking hardware from prototype into repeatable production
• Previous technical/team leadership experience strongly preferred

Santa Barbara / Goleta, CA. Onsite position, with some flexibility for hybrid model.

Full-time direct hire only; no C2C. Candidates must qualify as a U.S. Person under ITAR requirements.