ATD Laser Development Engineer

Intel Corporation; Chandler (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will shape next-generation laser packaging processes and equipment to enhance performance, reliability, and yield across Intel's assembly and packaging solutions.

The role requires strong skills in SPC/DOE, laser and optical systems, and collaboration with cross-functional teams. This college-grad position emphasizes hands-on development and rapid contribution in a fast-paced environment.

Qualifications

• Bachelor's or Master's in Physics, Mechanical or Optical Engineering or related STEM field.
• Proficiency in SPC and DOE principles.
• Fundamental understanding of laser and optical systems.

Responsibilities

• Design and develop laser assembly packaging processes and equipment.
• Optimize manufacturing processes for quality, cost, yield and productivity.
• Develop DOE-based process specifications and analyze data.
• Oversee manufacturability of layout designs and full packaging process lifecycle.
• Set laser process specifications and coordinate with suppliers.
• Innovate techniques, tools, and quality screening for early issue detection.
• Drive standardization of qualification procedures and quality systems.

Skills

SPC

DOE

Laser & optical systems

Education

Bachelor's degree in Physics or Engineering

Master's degree in Physics or Engineering

Tools

Python

Numpy/Pandas

SQL

JMP

Minitab

Job description

Job Details: Job Description: The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.

Key Responsibilities

• Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
• Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
• Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
• Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
• Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
• Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.

Minimum Qualifications

• Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field OR Master's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Fundamental understanding of laser and optical systems

Preferred Qualifications

• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
• Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
• Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.
• Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.

We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape.

Job Type

College Grad

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Additional Locations

Posting Statement

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US

$85,200.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website.