IC Package Engineer - High‑Reliability RF Packaging

SpaceX

Bastrop (TX)

On-site

USD 80,000 - 110,000

Full time

14 days+

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Benefits offered by this job

Competitive salary
Health benefits
Innovative work environment

Job summary

A leading aerospace manufacturer in Texas seeks a highly skilled IC Package Engineer to lead the development and implementation of integrated circuit packaging solutions. This role involves cross-functional collaboration to deliver high-performance electronics and requires strong hands-on experience with semiconductor packaging. Candidates should have a passion for technical innovation and a Bachelor’s degree in a relevant field. This position offers an exciting opportunity to advance technology for space exploration.

Qualifications

  • 1+ year experience in IC packaging solutions, including internships/projects.
  • Strong analytical skills with expertise in SPC and FMEA.

Responsibilities

  • Design and develop IC packaging technologies.
  • Define and execute reliability test plans for qualification.
  • Collaborate with PCB design teams for co-design compatibility.

Skills

IC packaging technologies
Thermal management techniques
Cross-functional collaboration
Root Cause Analysis

Education

Bachelor’s degree in mechanical, packaging engineering, materials science, or electrical engineering

Tools

AutoCAD
ANSYS

Job description

A leading aerospace manufacturer in Texas seeks a highly skilled IC Package Engineer to lead the development and implementation of integrated circuit packaging solutions. This role involves cross-functional collaboration to deliver high-performance electronics and requires strong hands-on experience with semiconductor packaging. Candidates should have a passion for technical innovation and a Bachelor’s degree in a relevant field. This position offers an exciting opportunity to advance technology for space exploration.
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