Design Engineering Manager - 3D/2.5D Packaging Lead

Fairweather, LLC; Austin (TX); On-site; USD 130,000 - 160,000; Full time

Job summary

University of Texas at Austin's Texas Institute for Electronics seeks a Design Engineering Manager to lead design engineers, oversee 2.5D/3D packaging projects, and guide mixed-signal circuit development for advanced semiconductor modules.

The role requires a strong background in device physics, leadership, and collaboration with product/test teams and EDA vendors to ensure performance and reliability across multi-domain designs.

Qualifications

• Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field.
• 10+ years of relevant industry experience in semiconductor IC design.
• Previous supervisory experience with small to medium-sized teams.
• Strong understanding of semiconductor device physics and mixed signal circuit design.
• Excellent problem-solving skills and attention to detail.
• Strong communication and teamwork skills.
• Ability to manage multiple projects in a fast-paced environment.
• Proficiency in industry-standard EDA software for circuit and/or package design.

Responsibilities

• Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment
• Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems.
• Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.
• Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.
• Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility.
• Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies.
• Other related functions as assigned.

Skills

Communication

Leadership

Problem solving

Project management

EDA software

Semiconductor physics

Teamwork

Education

Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field

Job description

University of Texas at Austin's Texas Institute for Electronics seeks a Design Engineering Manager to lead design engineers, oversee 2.5D/3D packaging projects, and guide mixed-signal circuit development for advanced semiconductor modules.

The role requires a strong background in device physics, leadership, and collaboration with product/test teams and EDA vendors to ensure performance and reliability across multi-domain designs.