IC Packaging Engineer - WLP at Apple Inc. Santa Clara, CA

Apple Inc.; Santa Clara (CA); On-site; USD 143,100 - 264,200; Full time

Job summary

Apple Inc. in Santa Clara, CA is seeking an IC Packaging Engineer to lead packaging technology development for SoC projects, including 2.5D/3D packaging, and to drive integration across multi-functional teams and external partners.

You will work closely with foundry and OSAT partners to move packaging concepts from design to high-volume manufacturing, while developing new materials and packaging specs for advanced products.

Qualifications

• BS and 3+ years of relevant industry experience.
• Experience in semiconductor packaging field preferred.
• Knowledge of materials characterization and analysis.
• Understanding of memory packaging developments.
• Ability to collaborate with multi-functional teams and overseas suppliers.

Responsibilities

• Lead packaging technology development including advanced 2.5D/3D packaging.
• Lead SoC package integration efforts with cross-functional teams.
• Drive package architecture and integration innovation.
• Collaborate with foundry and OSAT to move packaging from concept to high-volume manufacturing.
• Develop new materials and packaging specifications.
• Travel up to 5% internationally.

Skills

Wafer Level Packaging

2.5D Packaging

3D Packaging

Package Integration

APD

Virtuoso

Semiconductor Packaging

Education

BS degree in engineering

Tools

APD

Virtuoso

Job description

IC Packaging Engineer - WLP job at Apple Inc.. Santa Clara, CA. Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and package technology development for a variety of projects including SoC.

Description

• Lead packaging technology development including advanced 2.5D/3D packaging.
• Work with multi-functional team and lead SoC Package integration efforts.
• Package Architecture / Package Integration Innovation.
• Work with foundry and OSAT to bring packaging solution from concept to HVM.
• Drive industry with sophisticated Package solutions, new material development, and specs.
• 5% International travel.

Minimum Qualifications

• BS and 3+ years of relevant industry experience.

Preferred Qualifications

• We are looking for an individual with experience working in the Semiconductor Packaging field.
• Knowledge of materials characterization and analysis.
• Ideal candidate will have proven understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
• General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers.
• Ability to work independently and orchestrate projects with minimum supervision.
• Solution-oriented engineer who has proven fundamentals in engineering and physics.
• Shown capabilities using package design softwares, APD, Virtuoso, etc.
• Knowledge of the latest developments in memory packaging.
• Good program management skills.

Pay & Benefits

• At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $143,100 and $264,200, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits. Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Equal Opportunity Employer

• Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.