IC Package Design Engineer

Apple Inc.; Austin (TX); On-site; USD 90,000 - 130,000; Full time

Job summary

Apple Inc. is seeking a Package Design Engineer in Austin, Texas to drive the design and integration of advanced semiconductor packages. You will lead physical design across various technologies, collaborating closely with cross-functional teams to enhance performance. The ideal candidate should have proficiency in Cadence Allegro or Mentor Xpedition and expertise in high-speed layout and Signal Integrity. The position emphasizes design methodology improvements and automation with scripting languages. Join a diverse team committed to inclusion and innovation.

Qualifications

• Proven experience in IC package physical design.
• Strong understanding of high-speed interface layout constraints and SI/PI analysis.
• Solid grasp of substrate manufacturing processes and DFM.
• Familiarity with Unix/Linux and scripting for automation.

Responsibilities

• Perform physical layout of package substrates for diverse silicon.
• Execute parasitic extraction and S-parameter modeling.
• Lead cross-functional collaboration on package feasibility.
• Drive package design methodology improvements by developing automated flows.

Skills

Package Design Proficiency

High-Speed & SI/PI Expertise

Manufacturing & Materials Knowledge

Automation & Scripting Skills

Tools

Cadence Allegro

Mentor Xpedition

HFSS

PowerSI

Calibre

CAM350

Python

Perl

TCL

Job description

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next‑generation products while advancing design methodologies through automation and AI.

Description

As a Package design engineer, you will lead advanced package architecture, drive next‑generation package structure and configuration optimization, and own Package/SiP/module physical design from concept through tape‑out. You will collaborate closely with cross‑functional teams to deliver optimized SI/PI performance across a wide range of silicon technologies. You are expected to leverage AI tools to enhance design efficiency, quality and performance.

Responsibilities

• Perform physical layout of package substrates for diverse silicon, including System‑on‑Chip (SoC), Memory, RF, and cellular integrated circuits (ICs).
• Execute parasitic extraction (RLGC) and S‑parameter modeling to validate that package designs meet Signal and Power Integrity (SI/PI) performance targets.
• Lead cross‑functional collaboration on package feasibility and system co‑optimization; align with Product Design on chip floorplan, System Architecture on package configuration, and Silicon/SIPI teams on electrical performance.
• Drive package design methodology improvements by evaluating new CAD tools and developing automated design and verification flows to enhance efficiency and streamline the release process.

Preferred Qualifications

• Package Design Proficiency: Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms, with knowledge of diverse package types (SiP, PoP, wirebond) and verification tools (Calibre, CAM350).
• High‑Speed & SI/PI Expertise: Strong understanding of high‑speed interface layout constraints (DDR, PCIe) and Signal/Power Integrity (SI/PI) analysis, including experience with simulation tools like HFSS or PowerSI and parasitic extraction (RLGC, S‑parameters).
• Manufacturing & Materials Knowledge: Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability (DFM), and various sophisticated package configurations and assembly technology.
• Automation & Scripting Skills: Familiarity with a Unix/Linux environment and proficiency in scripting languages such as Python, Perl, or TCL to automate design tasks and improve workflows.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.