IC Packaging Design & Layout Engineer – High-Speed SI/PI

Draper Labs; Cambridge (MA); On-site; USD 82,300 - 220,000; Full time

Job summary

Draper is seeking an IC Packaging Design & Layout Engineer in Cambridge, MA to deliver advanced packaging solutions for Draper’s next generation hardware platforms. The role demands deep expertise in package architecture, high-speed layout, SI/PI analysis, and design for manufacturability (DFM).

You will collaborate with cross-functional teams—silicon design, thermal/mechanical, and manufacturing—to deliver manufacturable package designs that align with Draper’s strategic roadmap and ensure

Qualifications

• Bachelor's degree in electrical engineering or related field.
• Advanced degree preferred.
• 5–10 years of electrical engineering experience.
• Willing to obtain and maintain a US government security clearance.

Responsibilities

• Lead end-to-end package design for advanced ICs.
• Develop layouts for substrates, interposers, and die-to-die routing.
• Own SI/PI strategy and PDN design.
• Perform SPICE, EM, and S-parameter simulations.
• Collaborate with mechanical, RF, and board teams.
• Prepare package build docs and test plans.
• Mentor teammates and support proposals.

Skills

High-speed design

Signal integrity

DFM awareness

Education

Bachelor's degree in electrical engineering or related field

Advanced degree preferred

Tools

Siemens Xpedition

Ansys SIwave

HFSS

Job description

Draper is seeking an IC Packaging Design & Layout Engineer in Cambridge, MA to deliver advanced packaging solutions for Draper’s next generation hardware platforms. The role demands deep expertise in package architecture, high-speed layout, SI/PI analysis, and design for manufacturability (DFM).

You will collaborate with cross-functional teams—silicon design, thermal/mechanical, and manufacturing—to deliver manufacturable package designs that align with Draper’s strategic roadmap and ensure